 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| a SUMMARY High Performance Signal Processor for Communications, Graphics and Imaging Applications Super Harvard Architecture Four Independent Buses for Dual Data Fetch, Instruction Fetch and Nonintrusive I/O 32-Bit IEEE Floating-Point Computation Units-- Multiplier, ALU, and Shifter Dual-Ported On-Chip SRAM and Integrated I/O Peripherals--A Complete System-On-A-Chip Integrated Multiprocessing Features KEY FEATURES 40 MIPS, 25 ns Instruction Rate, Single-Cycle Instruction Execution 120 MFLOPS Peak, 80 MFLOPS Sustained Performance Dual Data Address Generators with Modulo and BitReverse Addressing Efficient Program Sequencing with Zero-Overhead Looping: Single-Cycle Loop Setup ADSP-2106x SHARC(R) DSP Microcomputer Family ADSP-21062/ADSP-21062L IEEE JTAG Standard 1149.1 Test Access Port and On-Chip Emulation 240-Lead Thermally Enhanced MQFP Package 225-Ball Plastic Ball Grid Array (PBGA) 32-Bit Single-Precision and 40-Bit Extended-Precision IEEE Floating-Point Data Formats or 32-Bit FixedPoint Data Format Parallel Computations Single-Cycle Multiply and ALU Operations in Parallel with Dual Memory Read/Writes and Instruction Fetch Multiply with Add and Subtract for Accelerated FFT Butterfly Computation 2 Mbit On-Chip SRAM Dual-Ported for Independent Access by Core Processor and DMA Off-Chip Memory Interfacing 4 Gigawords Addressable Programmable Wait State Generation, Page-Mode DRAM Support DUAL-PORTED SRAM BLOCK 0 BLOCK 1 CORE PROCESSOR TIMER INSTRUCTION CACHE 32 x 48-BIT ADDR TWO INDEPENDENT DUAL-PORTED BLOCKS PROCESSOR PORT DATA ADDR DATA JTAG TEST & EMULATION 7 I/O PORT DATA DATA ADDR ADDR DAG1 8 x 4 x 32 DAG2 8 x 4 x 24 PROGRAM SEQUENCER 24 32 IOD 48 IOA 17 PM ADDRESS BUS DM ADDRESS BUS EXTERNAL PORT ADDR BUS MUX MULTIPROCESSOR INTERFACE 32 PM DATA BUS 48 BUS CONNECT (PX) DM DATA BUS 40/32 DATA BUS MUX HOST PORT 48 DATA REGISTER FILE MULTIPLIER 16 x 40-BIT IOP REGISTERS (MEMORY MAPPED) BARREL SHIFTER ALU CONTROL, STATUS & DATA BUFFERS DMA CONTROLLER SERIAL PORTS (2) LINK PORTS (6) 4 6 6 36 I/O PROCESSOR Figure 1. ADSP-21062/ADSP-21062L Block Diagram SHARC is a registered trademark of Analog Devices, Inc. REV. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2000 ADSP-21062/ADSP-21062L DMA Controller 10 DMA Channels for Transfers Between ADSP-21062 Internal Memory and External Memory, External Peripherals, Host Processor, Serial Ports, or Link Ports Background DMA Transfers at 40 MHz, in Parallel with Full-Speed Processor Execution Host Processor Interface to 16- and 32-Bit Microprocessors Host Can Directly Read/Write ADSP-21062 Internal Memory Multiprocessing Glueless Connection for Scalable DSP Multiprocessing Architecture Distributed On-Chip Bus Arbitration for Parallel Bus Connect of Up to Six ADSP-21062s Plus Host Six Link Ports for Point-to-Point Connectivity and Array Multiprocessing 240 Mbytes/s Transfer Rate Over Parallel Bus 240 Mbytes/s Transfer Rate Over Link Ports Serial Ports Two 40 Mbit/s Synchronous Serial Ports with Companding Hardware Independent Transmit and Receive Functions TABLE OF CONTENTS GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . 3 ADSP-21000 FAMILY CORE ARCHITECTURE . . . . . . . 4 ADSP-21062/ADSP-21062L FEATURES . . . . . . . . . . . . . . 4 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . 8 TARGET BOARD CONNECTOR FOR EZ-ICE(R) PROBE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 RECOMMENDED OPERATING CONDITIONS . . . . . . 13 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . 13 TIMING SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . 17 Memory Read--Bus Master . . . . . . . . . . . . . . . . . . . . . . . 20 Memory Write--Bus Master . . . . . . . . . . . . . . . . . . . . . . 21 Synchronous Read/Write--Bus Master . . . . . . . . . . . . . . 22 Synchronous Read/Write--Bus Slave . . . . . . . . . . . . . . . . 24 Multiprocessor Bus Request and Host Bus Request . . . . . 26 Asynchronous Read/Write--Host to ADSP-21062 . . . . . . 28 Three-State Timing--Bus Master, Bus Slave, HBR, SBTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 DMA Handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Link Ports: 1 x CLK Speed Operation . . . . . . . . . . . . . . 33 Link Ports: 2 x CLK Speed Operation . . . . . . . . . . . . . . 34 Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 JTAG Test Access Port and Emulation . . . . . . . . . . . . . . . 39 OUTPUT DRIVE CURRENTS . . . . . . . . . . . . . . . . . . . . . 40 POWER DISSIPATION . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 TEST CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 ENVIRONMENTAL CONDITIONS . . . . . . . . . . . . . . . . 43 225 Ball Plastic Ball Grid Array (PBGA) Package Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . 44 225 Ball Plastic Ball Grid Array (PBGA) Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 PACKAGE DIMENSIONS, 225-Ball PBGA . . . . . . . . . . . 46 240-LEAD METRIC MQFP PIN CONFIGURATIONS . . 47 PACKAGE DIMENSIONS, 240-Lead Metric MQFP . . . 48 ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Figures Figure 1. ADSP-21062/ADSP-21062L Block Diagram . . . . 1 Figure 2. ADSP-21062 System . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3. Shared Memory Multiprocessing System . . . . . . . . 6 Figure 4. ADSP-21062/ADSP-21062L Memory Map . . . . . 7 Figure 5. Target Board Connector For ADSP-2106x EZ-ICE Emulator (Jumpers in Place) . . . . . . . . . . . . . . . 11 Figure 6. JTAG Scan Path Connections for Multiple ADSP-2106x Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 EZ-ICE is a registered trademark of Analog Devices, Inc. Figure 7. JTAG Clocktree for Multiple ADSP-2106x Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 8. Clock Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 9. Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 10. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 11. Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 12. Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 13. Memory Read--Bus Master . . . . . . . . . . . . . . . . 20 Figure 14. Memory Write--Bus Master . . . . . . . . . . . . . . . 21 Figure 15. Synchronous Read/Write--Bus Master . . . . . . . 23 Figure 16. Synchronous Read/Write--Bus Slave . . . . . . . . . 25 Figure 17. Multiprocessor Bus Request and Host Bus Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 18a. Synchronous REDY Timing . . . . . . . . . . . . . . 28 Figure 18b. Asynchronous Read/Write--Host to ADSP-21062 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 19a. Three-State Timing (Bus Transition Cycle, SBTS Assertion) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 19b. Three-State Timing (Host Transition Cycle) . . 30 Figure 20. DMA Handshake Timing . . . . . . . . . . . . . . . . . 32 Figure 21. Link Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 22. Serial Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 23. External Late Frame Sync . . . . . . . . . . . . . . . . . 38 Figure 24. IEEE 11499.1 JTAG Test Access Port . . . . . . . 39 Figure 25. Output Enable/Disable . . . . . . . . . . . . . . . . . . . 41 Figure 26. Equivalent Device Loading for AC Measurements (Includes All Fixtures) . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 27. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) . . . . . . . . . . . . . . . . . . . 41 Figure 28. ADSP-21062 Typical Drive Currents (VDD = 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 29. Typical Output Rise Time (10%-90% VDD) vs. Load Capacitance (VDD = 5 V) . . . . . . . . . . . . . . . . . . 42 Figure 30. Typical Output Rise Time (0.8 V-2.0 V) vs. Load Capacitance (VDD = 5 V) . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 31. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (VDD = 5 V) . . . . . . . . 42 Figure 32. ADSP-21062 Typical Drive Currents (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 33. Typical Output Rise Time (10%-90% VDD) vs. Load Capacitance (VDD = 3.3 V) . . . . . . . . . . . . . . . . 42 Figure 34. Typical Output Rise Time (0.8 V-2.0 V) vs. Load Capacitance (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . 43 Figure 35. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (VDD = 3.3 V) . . . . . . . 43 -2- REV. C ADSP-21062/ADSP-21062L S GENERAL NOTE including a 2 Mbit SRAM memory (4 Mbit on the ADSP-21060), host processor interface, DMA controller, serial ports and link port and parallel bus connectivity for glueless DSP multiprocessing. Figure 1 shows a block diagram of the ADSP-21062, illustrating the following architectural features: Computation Units (ALU, Multiplier and Shifter) with a Shared Data Register File Data Address Generators (DAG1, DAG2) Program Sequencer with Instruction Cache Interval Timer On-Chip SRAM External Port for Interfacing to Off-Chip Memory and Peripherals Host Port and Multiprocessor Interface DMA Controller Serial Ports and Link Ports JTAG Test Access Port Figure 2 shows a typical single-processor system. A multiprocessing system is shown in Figure 3. Table I. ADSP-21062/ADSP-21062L Benchmarks (@ 40 MHz) This data sheet represents production released specifications for the ADSP-21062 (5 V) and ADSP-21062L (3.3 V) processors, for both 33 MHz and 40 MHz speed grades. The product name "ADSP-21062" is used throughout this data sheet to represent all devices, except where expressly noted. GENERAL DESCRIPTION The ADSP-21062 SHARC--Super Harvard Architecture Computer--is a signal processing microcomputer that offers new capabilities and levels of performance. The ADSP-21062 SHARCs are 32-bit processors optimized for high performance DSP applications. The ADSP-21062 builds on the ADSP-21000 DSP core to form a complete system-on-a-chip, adding a dualported on-chip SRAM and integrated I/O peripherals supported by a dedicated I/O bus. Fabricated in a high speed, low power CMOS process, the ADSP-21062 has a 25 ns instruction cycle time and operates at 40 MIPS. With its on-chip instruction cache, the processor can execute every instruction in a single cycle. Table I shows performance benchmarks for the ADSP-21062. The ADSP-21062 SHARC represents a new standard of integration for signal computers, combining a high performance floating-point DSP core with integrated, on-chip system features 1024-Pt. Complex FFT (Radix 4, with Digit Reverse) FIR Filter (per Tap) IIR Filter (per Biquad) Divide (y/x) Inverse Square Root (1/x) DMA Transfer Rate 0.46 ms 25 ns 100 ns 150 ns 225 ns 240 Mbytes/s 18,221 cycles 1 cycle 4 cycles 6 cycles 9 cycles REV. C -3- ADSP-21062/ADSP-21062L ADSP-21000 FAMILY CORE ARCHITECTURE Instruction Cache The ADSP-21062 includes the following architectural features of the ADSP-21000 family core. The ADSP-21062 processors are code- and function-compatible with the ADSP-21020. Independent, Parallel Computation Units The arithmetic/logic unit (ALU), multiplier and shifter all perform single-cycle instructions. The three units are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. These computation units support IEEE 32-bit singleprecision floating-point, extended precision 40-bit floatingpoint, and 32-bit fixed-point data formats. ADSP-2106x CONTROL ADDRESS 1x CLOCK CLKIN EBOOT LBOOT 4 IRQ2-0 FLAG3-0 TIMEXP LxCLK LxACK LxDAT3-0 TCLK0 RCLK0 TFS0 RSF0 DT0 DR0 TCLK1 RCLK1 TFS1 RFS1 DT1 DR1 RPBA ID2-0 RESET BMS CS ADDR BOOT EPROM (OPTIONAL) The ADSP-21062 includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and two data values. The cache is selective--only the instructions whose fetches conflict with PM bus data accesses are cached. This allows full-speed execution of core, looped operations such as digital filter multiply-accumulates and FFT butterfly processing. Data Address Generators with Hardware Circular Buffers 3 DATA ADDR ADDR31-0 DATA47-0 The ADSP-21062's two data address generators (DAGs) implement circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs of the ADSP-21062 contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reducing overhead, increasing performance and simplifying implementation. Circular buffers can start and end at any memory location. Flexible Instruction Set DATA LINK DEVICES (6 MAXIMUM) (OPTIONAL) RD WR ACK MS3-0 PAGE SBTS SW ADRCLK DMAR1-2 DMAG1-2 CS HBR HBG REDY BR1-6 CPA JTAG 7 MEMORY AND OE PERIPHERALS (OPTIONAL) WE DATA ACK CS DMA DEVICE (OPTIONAL) DATA The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP21062 can conditionally execute a multiply, an add, a subtract and a branch, all in a single instruction. ADSP-21062/ADSP-21062L FEATURES SERIAL DEVICE (OPTIONAL) Augmenting the ADSP-21000 family core, the ADSP-21062 adds the following architectural features: HOST PROCESSOR INTERFACE (OPTIONAL) ADDR DATA SERIAL DEVICE (OPTIONAL) Dual-Ported On-Chip Memory Figure 2. ADSP-21062 System Data Register File The ADSP-21062 contains two megabits of on-chip SRAM, organized as two blocks of 1 Mbits each, which can be configured for different combinations of code and data storage. Each memory block is dual-ported for single-cycle, independent accesses by the core processor and I/O processor or DMA controller. The dual-ported memory and separate on-chip buses allow two data transfers from the core and one from I/O, all in a single cycle. On the ADSP-21062, the memory can be configured as a maximum of 64K words of 32-bit data, 128K words of 16-bit data, 40K words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to two megabits. All of the memory can be accessed as 16-bit, 32-bit or 48-bit words. A 16-bit floating-point storage format is supported, which effectively doubles the amount of data that may be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floatingpoint formats is done in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data, using the DM bus for transfers, and the other block stores instructions and data, using the PM bus for transfers. Using the DM bus and PM bus in this way, with one dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. Single-cycle execution is also maintained when one of the data operands is transferred to or from off-chip, via the ADSP21062's external port. A general purpose data register file is used for transferring data between the computation units and the data buses, and for storing intermediate results. This 10-port, 32-register (16 primary, 16 secondary) register file, combined with the ADSP21000 Harvard architecture, allows unconstrained data flow between computation units and internal memory. Single-Cycle Fetch of Instruction and Two Operands The ADSP-21062 features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 1). With its separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch two operands and an instruction (from the cache), all in a single cycle. -4- REV. C ADSP-21062/ADSP-21062L Off-Chip Memory and Peripherals Interface The ADSP-21062's external port provides the processor's interface to off-chip memory and peripherals. The 4-gigaword offchip address space is included in the ADSP-21062's unified address space. The separate on-chip buses--for PM addresses, PM data, DM addresses, DM data, I/O addresses and I/O data--are multiplexed at the external port to create an external system bus with a single 32-bit address bus and a single 48-bit (or 32-bit) data bus. Addressing of external memory devices is facilitated by on-chip decoding of high-order address lines to generate memory bank select signals. Separate control lines are also generated for simplified addressing of page-mode DRAM. The ADSP-21062 provides programmable memory wait states and external memory acknowledge controls to allow interfacing to DRAM and peripherals with variable access, hold and disable time requirements. Host Processor Interface include interrupt generation upon completion of DMA transfers and DMA chaining for automatic linked DMA transfers. Serial Ports The ADSP-21062 features two synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices. The serial ports can operate at the full clock rate of the processor, providing each with a maximum data rate of 40 Mbit/s. Independent transmit and receive functions provide greater flexibility for serial communications. Serial port data can be automatically transferred to and from on-chip memory via DMA. Each of the serial ports offers TDM multichannel mode. The serial ports can operate with little-endian or big-endian transmission formats, with word lengths selectable from 3 bits to 32 bits. They offer selectable synchronization and transmit modes as well as optional -law or A-law companding. Serial port clocks and frame syncs can be internally or externally generated. Multiprocessing The ADSP-21062's host interface allows easy connection to standard microprocessor buses, both 16-bit and 32-bit, with little additional hardware required. Asynchronous transfers at speeds up to the full clock rate of the processor are supported. The host interface is accessed through the ADSP-21062's external port and is memory-mapped into the unified address space. Four channels of DMA are available for the host interface; code and data transfers are accomplished with low software overhead. The host processor requests the ADSP-21062's external bus with the host bus request (HBR), host bus grant (HBG), and ready (REDY) signals. The host can directly read and write the internal memory of the ADSP-21062, and can access the DMA channel setup and mailbox registers. Vector interrupt support is provided for efficient execution of host commands. DMA Controller The ADSP-21062 offers powerful features tailored to multiprocessor DSP systems. The unified address space (see Figure 4) allows direct interprocessor accesses of each ADSP21062's internal memory. Distributed bus arbitration logic is included on-chip for simple, glueless connection of systems containing up to six ADSP-21062s and a host processor. Master processor changeover incurs only one cycle of overhead. Bus arbitration is selectable as either fixed or rotating priority. Bus lock allows indivisible read-modify-write sequences for semaphores. A vector interrupt is provided for interprocessor commands. Maximum throughput for interprocessor data transfer is 240 Mbytes/s over the link ports or external port. Broadcast writes allow simultaneous transmission of data to all ADSP-21062s and can be used to implement reflective semaphores. Link Ports The ADSP-21062's on-chip DMA controller allows zerooverhead data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP-21062's internal memory and either external memory, external peripherals or a host processor. DMA transfers can also occur between the ADSP-21062's internal memory and its serial ports or link ports. DMA transfers between external memory and external peripheral devices are another option. External bus packing to 16-, 32-, or 48-bit words is performed during DMA transfers. Ten channels of DMA are available on the ADSP-21062--two via the link ports, four via the serial ports, and four via the processor's external port (for either host processor, other ADSP-21062s, memory or I/O transfers). Four additional link port DMA channels are shared with serial port 1 and the external port. Programs can be downloaded to the ADSP21062 using DMA transfers. Asynchronous off-chip peripherals can control two DMA channels using DMA Request/ Grant lines (DMAR1-2, DMAG1-2 ). Other DMA features The ADSP-21062 features six 4-bit link ports that provide additional I/O capabilities. The link ports can be clocked twice per cycle, allowing each to transfer eight bits of data per cycle. Link port I/O is especially useful for point-to-point interprocessor communication in multiprocessing systems. The link ports can operate independently and simultaneously, with a maximum data throughput of 240 Mbytes/s. Link port data is packed into 32- or 48-bit words, and can be directly read by the core processor or DMA-transferred to on-chip memory. Each link port has its own double-buffered input and output registers. Clock/acknowledge handshaking controls link port transfers. Transfers are programmable as either transmit or receive. Program Booting The internal memory of the ADSP-21062 can be booted at system power-up from either an 8-bit EPROM, a host processor, or through one of the link ports. Selection of the boot source is controlled by the BMS (Boot Memory Select), EBOOT (EPROM Boot), and LBOOT (Link/Host Boot) pins. 32-bit and 16-bit host processors can be used for booting. REV. C -5- ADSP-21062/ADSP-21062L CONTROL ADDRESS ADDRESS ADSP-2106x #6 ADSP-2106x #5 ADSP-2106x #4 ADSP-2106x #3 CLKIN RESET RPBA 011 3 ID 2-0 CONTROL ADDR31-0 DATA47-0 CPA BR1-2, BR4-6 BR3 5 ADSP-2106x #2 CLKIN RESET RPBA 3 010 ID 2-0 CONTROL ADDR31-0 DATA47-0 CPA BR1, BR3-6 BR2 5 CONTROL ADSP-2106x #1 1x CLOCK RESET CLKIN ADDR31-0 RESET RPBA 3 001 ID 2-0 DATA47-0 RD WR ACK MS3-0 BMS PAGE SBTS SW ADRCLK CS HBR HBG REDY CPA BR2-6 BR1 5 DATA DATA ADDR DATA OE WE ACK CS CS ADDR DATA GLOBAL MEMORY AND PERIPHERALS (OPTIONAL) CONTROL BOOT EPROM (OPTIONAL) HOST PROCESSOR INTERFACE (OPTIONAL) ADDR DATA Figure 3. Shared Memory Multiprocessing System -6- REV. C ADSP-21062/ADSP-21062L 0x0000 0000 IOP REGISTERS 0x0040 0000 BANK 0 DRAM (OPTIONAL) INTERNAL MEMORY SPACE 0x0002 0000 NORMAL WORD ADDRESSING 0x0004 0000 SHORT WORD ADDRESSING 0x0008 0000 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=001 0x0010 0000 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=010 0x0018 0000 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=011 0x0020 0000 MS0 BANK 1 MS1 BANK 2 MS2 MULTIPROCESSOR MEMORY SPACE INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=100 0x0028 0000 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=101 0x0030 0000 INTERNAL MEMORY SPACE OF ADSP-2106x WITH ID=110 0x0038 0000 BROADCAST WRITE TO ALL ADSP-2106xs 0x003F FFFF EXTERNAL MEMORY SPACE BANK 3 MS3 BANK SIZE IS SELECTED BY MSIZE BIT FIELD OF SYSCON REGISTER. NONBANKED NORMAL WORD ADDRESSING: 32-BIT DATA WORDS 48-BIT INSTRUCTION WORDS SHORT WORD ADDRESSING: 16-BIT DATA WORDS 0xFFFF FFFF Figure 4. ADSP-21062/ADSP-21062L Memory Map DEVELOPMENT TOOLS The ADSP-21062 is supported with a complete set of software and hardware development tools, including an EZ-ICE InCircuit Emulator, EZ-LAB(R) development board, EZ-KIT, and development software. The EZ-LAB contains an evaluation board with an ADSP-21062 (5 V) processor and provides a serial connection to your PC. The SHARC EZ-KIT combines the ADSP21000 Family Development Software for the PC and the EZ-LAB ADSP-21062's Development Board in one package. The EZ-KIT contains in addition to the EZ-LAB development board, an optimizing compiler, assembler, instruction level simulator, run-time libraries, diagnostic utilities and a complete set of example programs. The same EZ-ICE hardware can be used for the ADSP-21060/ ADSP-21061, to fully emulate the ADSP-21062, with the exception of displaying and modifying the two new SPORTS registers. The emulator will not display these two registers, but your code can use them. Analog Devices' ADSP-21000 Family Development Software includes an easy to use Assembler based on an algebraic syntax, an Assembly Library/Librarian, a Linker, an Instruction-level Simulator, an ANSI C optimizing Compiler, the CBugTM C Source-Level Debugger, and a C Runtime Library including DSP and mathematical functions. The Optimizing Compiler includes Numerical C extensions based on the work of the ANSI Numerical C Extensions Group. Numerical C provides extensions to the C language for array selection, vector math operations, complex data types, circular pointers, and variably CBug and SHARCPAC are trademarks of Analog Devices, Inc. EZ-LAB is a registered trademark of Analog Devices, Inc. dimensioned arrays. The ADSP-21000 Family Development Software is available for both the PC and Sun platforms. The ADSP-21062 EZ-ICE Emulator uses the IEEE 1149.1 JTAG test access port of the ADSP-21062 processor to monitor and control the target board processor during emulation. The EZ-ICE provides full-speed emulation, allowing inspection and modification of memory, registers, and processor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor's JTAG interface--the emulator does not affect target system loading or timing. Further details and ordering information are available in the ADSP-21000 Family Hardware & Software Development Tools data sheet (ADDS-210xx-TOOLS). This data sheet can be requested from any Analog Devices sales office, distributor or the Literature Center. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the SHARC processor family. Hardware tools include SHARC PC plug-in cards, multiprocessor SHARC VME boards, and daughter card modules with multiple SHARCs and additional memory. These modules are based on the SHARCPACTM module specification. Third party software tools include an Ada compiler, DSP libraries, operating systems, and block diagram design tools. ADDITIONAL INFORMATION This data sheet provides a general overview of the ADSP-21062 architecture and functionality. For detailed information on the ADSP-21000 Family core architecture and instruction set, refer to the ADSP-21062 SHARC User's Manual, Second Edition. -7- REV. C ADSP-21062/ADSP-21062L PIN FUNCTION DESCRIPTIONS ADSP-21062 pin definitions are listed below. All pins are identical on the ADSP-21062 and ADSP-21062L. Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST). Unused inputs should be tied or pulled to VDD or GND, except for ADDR31-0, DATA47-0, FLAG3-0, SW, and inputs that have internal pull-up or pull-down resistors (CPA, ACK, DTx, Pin ADDR31-0 Type I/O/T Function DRx, TCLKx, RCLKx, LxDAT3-0, LxCLK, LxACK, TMS and TDI)--these pins can be left floating. These pins have a logic-level hold circuit that prevents the input from floating internally. A = Asynchronous G = Ground I = Input O = Output P = Power Supply S = Synchronous (A/D) = Active Drive (O/D) = Open Drain T = Three-State (when SBTS is asserted, or when the ADSP-21062 is a bus slave) External Bus Address. The ADSP-21062 outputs addresses for external memory and peripherals on these pins. In a multiprocessor system the bus master outputs addresses for read/writes of the internal memory or IOP registers of other ADSP-21062s. The ADSP-21062 inputs addresses when a host processor or multiprocessing bus master is reading or writing its internal memory or IOP registers. External Bus Data. The ADSP-21062 inputs and outputs data and instructions on these pins. 32-bit single-precision floating-point data and 32-bit fixed-point data is transferred over bits 47-16 of the bus. 40-bit extended-precision floating-point data is transferred over bits 47-8 of the bus. 16-bit short word data is transferred over bits 31-16 of the bus. In PROM boot mode, 8-bit data is transferred over bits 23-16. Pull-up resistors on unused DATA pins are not necessary. Memory Select Lines. These lines are asserted (low) as chip selects for the corresponding banks of external memory. Memory bank size must be defined in the ADSP-21062's system control register (SYSCON). The MS3-0 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS3-0 lines are inactive; they are active however when a conditional memory access instruction is executed, whether or not the condition is true. MS0 can be used with the PAGE signal to implement a bank of DRAM memory (Bank 0). In a multiprocessing system the MS3-0 lines are output by the bus master. Memory Read Strobe. This pin is asserted (low) when the ADSP-21062 reads from external memory devices or from the internal memory of other ADSP-21062s. External devices (including other ADSP-21062s) must assert RD to read from the ADSP-21062's internal memory. In a multiprocessing system RD is output by the bus master and is input by all other ADSP-21062s. Memory Write Strobe. This pin is asserted (low) when the ADSP-21062 writes to external memory devices or to the internal memory of other ADSP-21062s. External devices must assert WR to write to the ADSP-21062's internal memory. In a multiprocessing system WR is output by the bus master and is input by all other ADSP-21062s. DRAM Page Boundary. The ADSP-21062 asserts this pin to signal that an external DRAM page boundary has been crossed. DRAM page size must be defined in the ADSP-21062's memory control register (WAIT). DRAM can only be implemented in external memory Bank 0; the PAGE signal can only be activated for Bank 0 accesses. In a multiprocessing system PAGE is output by the bus master. Clock Output Reference. In a multiprocessing system ADRCLK is output by the bus master. Synchronous Write Select. This signal is used to interface the ADSP-21062 to synchronous memory devices (including other ADSP-21062s). The ADSP-21062 asserts SW (low) to provide an early indication of an impending write cycle, which can be aborted if WR is not later asserted (e.g., in a conditional write instruction). In a multiprocessing system, SW is output by the bus master and is input by all other ADSP-21062s to determine if the multiprocessor memory access is a read or write. SW is asserted at the same time as the address output. A host processor using synchronous writes must assert this pin when writing to the ADSP-21062(s). Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an external memory access. ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. The ADSP-21062 deasserts ACK as an output to add wait states to a synchronous access of its internal memory. In a multiprocessing system, a slave ADSP21062 deasserts the bus master's ACK input to add wait state(s) to an access of its internal memory. The bus master has a keeper latch on its ACK pin that maintains the input at the level to which it was last driven. DATA47-0 I/O/T MS3-0 O/T RD I/O/T WR I/O/T PAGE O/T ADRCLK SW O/T I/O/T ACK I/O/S -8- REV. C ADSP-21062/ADSP-21062L Pin SBTS Type I/S Function Suspend Bus Three-State. External devices can assert SBTS (low) to place the external bus address, data, selects and strobes in a high impedance state for the following cycle. If the ADSP-21062 attempts to access external memory while SBTS is asserted, the processor will halt and the memory access will not be completed until SBTS is deasserted. SBTS should only be used to recover from host processor/ADSP-21062 deadlock, or used with a DRAM controller. Interrupt Request Lines. May be either edge-triggered or level-sensitive. Flag Pins. Each is configured via control bits as either an input or output. As an input, they can be tested as a condition. As an output, they can be used to signal external peripherals. Timer Expired. Asserted for four cycles when the timer is enabled and TCOUNT decrements to zero. Host Bus Request. This pin must be asserted by a host processor to request control of the ADSP-21062's external bus. When HBR is asserted in a multiprocessing system, the ADSP-21062 that is bus master will relinquish the bus and assert HBG. To relinquish the bus, the ADSP-21062 places the address, data, select and strobe lines in a high impedance state. HBR has priority over all ADSP-21062 bus requests (BR6-1) in a multiprocessing system. Host Bus Grant. Acknowledges an HBR bus request, indicating that the host processor may take control of the external bus. HBG is asserted (held low) by the ADSP-21062 until HBR is released. In a multiprocessing system, HBG is output by the ADSP-21062 bus master and is monitored by all others. Chip Select. Asserted by host processor to select the ADSP-21062. Host Bus Acknowledge. The ADSP-21062 deasserts REDY (low) to add wait states to an asynchronous access of its internal memory or IOP registers by a host. This pin is an open drain output (O/D) by default; it can be programmed in the ADREDY bit of the SYSCON register to be active drive (A/D). REDY will only be output if the CS and HBR inputs are asserted. DMA Request 1 (DMA Channel 7). DMA Request 2 (DMA Channel 8). DMA Grant 1 (DMA Channel 7). DMA Grant 2 (DMA Channel 8). Multiprocessing Bus Requests. Used by multiprocessing ADSP-21062s to arbitrate for bus mastership. An ADSP-21062 only drives its own BRx line (corresponding to the value of its ID2-0 inputs) and monitors all others. In a multiprocessor system with less than six ADSP-21062s, the unused BRx pins should be pulled high; the processor's own BRx line must not be pulled high or low because it is an output. Multiprocessing ID. Determines which multiprocessing bus request (BR1 - BR6) is used by ADSP21062. ID = 001 corresponds to BR1, ID = 010 corresponds to BR2, etc. ID = 000 in single-processor systems. These lines are a system configuration selection which should be hardwired or changed at reset only. Rotating Priority Bus Arbitration Select. When RPBA is high, rotating priority for multiprocessor bus arbitration is selected. When RPBA is low, fixed priority is selected. This signal is a system configuration selection which must be set to the same value on every ADSP-21062. If the value of RPBA is changed during system operation, it must be changed in the same CLKIN cycle on every ADSP-21062. Core Priority Access. Asserting its CPA pin allows the core processor of an ADSP-21062 bus slave to interrupt background DMA transfers and gain access to the external bus. CPA is an open drain output that is connected to all ADSP-21062s in the system. The CPA pin has an internal 5 k pull-up resistor. If core access priority is not required in a system, the CPA pin should be left unconnected. Data Transmit (Serial Ports 0, 1). Each DT pin has a 50 k internal pull-up resistor. Data Receive (Serial Ports 0, 1). Each DR pin has a 50 k internal pull-up resistor. Transmit Clock (Serial Ports 0, 1). Each TCLK pin has a 50 k internal pull-up resistor. Receive Clock (Serial Ports 0, 1). Each RCLK pin has a 50 k internal pull-up resistor. IRQ2-0 FLAG3-0 TIMEXP HBR I/A I/O/A O I/A HBG I/O CS I/A REDY (O/D) O DMAR1 DMAR2 DMAG1 DMAG2 BR6-1 I/A I/A O/T O/T I/O/S ID2-0 I RPBA I/S CPA (O/D) I/O DTx DRx TCLKx RCLKx O I I/O I/O REV. C -9- ADSP-21062/ADSP-21062L Pin TFSx RFSx LxDAT3-0 LxCLK LxACK EBOOT Type I/O I/O I/O I/O I/O I Function Transmit Frame Sync (Serial Ports 0, 1). Receive Frame Sync (Serial Ports 0, 1). Link Port Data (Link Ports 0-5). Each LxDAT pin has a 50 k internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register. Link Port Clock (Link Ports 0-5). Each LxCLK pin has a 50 k internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register. Link Port Acknowledge (Link Ports 0-5). Each LxACK pin has a 50 k internal pull-down resistor that is enabled or disabled by the LPDRD bit of the LCOM register. EPROM Boot Select. When EBOOT is high, the ADSP-21062 is configured for booting from an 8bit EPROM. When EBOOT is low, the LBOOT and BMS inputs determine booting mode. See table below. This signal is a system configuration selection that should be hardwired. Link Boot. When LBOOT is high, the ADSP-21062 is configured for link port booting. When LBOOT is low, the ADSP-21062 is configured for host processor booting or no booting. See table below. This signal is a system configuration selection that should be hardwired. Boot Memory Select. Output: Used as chip select for boot EPROM devices (when EBOOT = 1, LBOOT = 0). In a multiprocessor system, BMS is output by the bus master. Input: When low, indicates that no booting will occur and that ADSP-21062 will begin executing instructions from external memory. See table below. This input is a system configuration selection that should be hardwired. *Three-statable only in EPROM boot mode (when BMS is an output). EBOOT 1 0 0 0 0 1 CLKIN RESET I I/A LBOOT 0 0 1 0 1 1 BMS Output 1 (Input) 1 (Input) 0 (Input) 0 (Input) x (Input) Booting Mode EPROM (Connect BMS to EPROM chip select.) Host Processor Link Port No Booting. Processor executes from external memory. Reserved Reserved LBOOT I BMS I/O/T* Clock In. External clock input to the ADSP-21062. The instruction cycle rate is equal to CLKIN. CLKIN may not be halted, changed, or operated below the minimum specified frequency. Processor Reset. Resets the ADSP-21062 to a known state and begins program execution at the program memory location specified by the hardware reset vector address. This input must be asserted (low) at power-up. Test Clock (JTAG). Provides an asynchronous clock for JTAG boundary scan. Test Mode Select (JTAG). Used to control the test state machine. TMS has a 20 k internal pull-up resistor. Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 20 k internal pull-up resistor. Test Data Output (JTAG). Serial scan output of the boundary scan path. Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after powerup or held low for proper operation of the ADSP-21062. TRST has a 20 k internal pull-up resistor. Emulation Status. Must be connected to the ADSP-21062 EZ-ICE target board connector only. Reserved, leave unconnected. Power Supply; nominally +5.0 V dc for 5 V devices or +3.3 V dc for 3.3 V devices. (30 pins) Power Supply Return. (30 pins) Do Not Connect. Reserved pins which must be left open and unconnected. TCK TMS TDI TDO TRST EMU ICSA VDD GND NC I I/S I/S O I/A O O P G -10- REV. C ADSP-21062/ADSP-21062L TARGET BOARD CONNECTOR FOR EZ-ICE PROBE The ADSP-2106x EZ-ICE Emulator uses the IEEE 1149.1 JTAG test access port of the ADSP-2106x to monitor and control the target board processor during emulation. The EZICE probe requires the ADSP-2106x's CLKIN, TMS, TCK, TRST, TDI, TDO, EMU, and GND signals be made accessible on the target system via a 14-pin connector (a 2 row x 7 pin strip header) such as that shown in Figure 5. The EZ-ICE probe plugs directly onto this connector for chip-on-board emulation. You must add this connector to your target board design if you intend to use the ADSP-2106x EZ-ICE. The total trace length between the EZ-ICE connector and the furthest device sharing the EZ-ICE JTAG pin should be limited to 15 inches maximum for guaranteed operation. This length restriction must include EZ-ICE JTAG signals that are routed to one or more ADSP-2106x devices, or a combination of ADSP2106x devices and other JTAG devices on the chain. 1 GND 3 KEY (NO PIN) 5 BTMS 7 BTCK 9 BTRST 11 BTDI 13 GND TOP VIEW 14 TDO 9 12 TDI 10 TRST 8 TCK 6 TMS 4 CLKIN (OPTIONAL) 2 EMU The 14-pin, 2-row pin strip header is keyed at the Pin 3 location -- Pin 3 must be removed from the header. The pins must be 0.025 inch square and at least 0.20 inch in length. Pin spacing should be 0.1 x 0.1 inches. Pin strip headers are available from vendors such as 3M, McKenzie, and Samtec. The BTMS, BTCK, BTRST, and BTDI signals are provided so that the test access port can also be used for board-level testing. When the connector is not being used for emulation, place jumpers between the BXXX pins and the XXX pins as shown in Figure 5. If you are not going to use the test access port for board testing, tie BTRST to GND and tie or pull up BTCK to VDD. The TRST pin must be asserted after power-up (through BTRST on the connector) or held low for proper operation of the ADSP-2106x. None of the BXXX pins (Pins 5, 7, 9, 11) are connected on the EZ-ICE probe. The JTAG signals are terminated on the EZ-ICE probe as follows: Signal TMS TCK Termination Driven through 22 Resistor (16 mA Driver) Driven at 10 MHz through 22 Resistor (16 mA Driver) TRST* Active Low Driven through 22 Resistor (16 mA Driver) (Pulled Up by On-Chip 20 k Resistor) TDI Driven by 22 Resistor (16 mA Driver) TDO One TTL Load, Split Termination (160/220) CLKIN One TTL Load, Split Termination (160/220) EMU Active Low 4.7 k Pull-Up Resistor, One TTL Load (Open-Drain Output from the DSP) *TRST is driven low until the EZ-ICE probe is turned on by the emulator at software start-up. After software start-up, TRST is driven high. Figure 5. Target Board Connector For ADSP-2106x EZ-ICE Emulator (Jumpers in Place) ADSP-2106x #1 TDI EZ-ICE JTAG CONNECTOR OTHER JTAG CONTROLLER TCK TMS EMU TRST TDO CLKIN OPTIONAL TDI TMS TCK JTAG DEVICE (OPTIONAL) TDI TMS TCK ADSP-2106x n TDI EMU EMU TMS TCK TDO TRST EMU EMU TDO TRST TDO TRST Figure 6. JTAG Scan Path Connections for Multiple ADSP-2106x Systems REV. C -11- ADSP-21062/ADSP-21062L Figure 6 shows JTAG scan path connections for systems that contain multiple ADSP-2106x processors. Connecting CLKIN to Pin 4 of the EZ-ICE header is optional. The emulator only uses CLKIN when directed to perform operations such as starting, stopping, and single-stepping multiple ADSP-2106xs in a synchronous manner. If you do not need these operations to occur synchronously on the multiple processors, simply tie Pin 4 of the EZ-ICE header to ground. If synchronous multiprocessor operations are needed and CLKIN is connected, clock skew between the multiple ADSP21062 processors and the CLKIN pin on the EZ-ICE header must be minimal. If the skew is too large, synchronous operations may be off by one or more cycles between processors. For synchronous multiprocessor operation TCK, TMS, CLKIN and EMU should be treated as critical signals in terms of skew, and should be laid out as short as possible on your board. If TCK, TMS, and CLKIN are driving a large number of ADSP21062s (more than eight) in your system, then treat them as a "clock tree" using multiple drivers to minimize skew. (See Figure 7 "JTAG Clock Tree" and "Clock Distribution" in the "High Frequency Design Considerations" section of the ADSP2106x User's Manual, Second Edition.) If synchronous multiprocessor operations are not needed (i.e., CLKIN is not connected), just use appropriate parallel termination on TCK and TMS. TDI, TDO, EMU and TRST are not critical signals in terms of skew. For complete information on the SHARC EZ-ICE, see the ADSP-21000 Family JTAG EZ-ICE User's Guide and Reference. TDI TDO TDI TDO TDI TDO 5k * TDI TDO TDI TDO TDI TDO TDI EMU TCK TMS TRST TDO CLKIN 5k * EMU SYSTEM CLKIN *OPEN DRAIN DRIVER OR EQUIVALENT, i.e., Figure 7. JTAG Clocktree for Multiple ADSP-2106x Systems -12- REV. C ADSP-21062/ADSP-21062L ADSP-21062-SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS (5 V) Parameter VDD TCASE VIH1 VIH2 VIL Supply Voltage Case Operating Temperature High Level Input Voltage1 High Level Input Voltage2 Low Level Input Voltage1, 2 Test Conditions A Grade Min Max 4.75 -40 2.0 2.2 -0.5 5.25 +85 VDD + 0.5 VDD + 0.5 0.8 C Grade Min Max 4.75 -40 2.0 2.2 -0.5 5.25 +100 VDD + 0.5 VDD + 0.5 0.8 K Grade Min Max 4.75 0 2.0 2.2 -0.5 5.25 +85 VDD + 0.5 VDD + 0.5 0.8 Units V C V V V @ VDD = max @ VDD = max @ VDD = min NOTES 1 Applies to input and bidirectional pins: DATA 47-0, ADDR 31-0, RD, WR, SW, ACK, SBTS, IRQ 2-0, FLAG 3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 2 Applies to input pins: CLKIN, RESET, TRST. ELECTRICAL CHARACTERISTICS (5 V) Parameter VOH VOL IIH IIL IILP IOZH IOZL IOZHP IOZLC IOZLA IOZLAR IOZLS CIN High Level Output Voltage Low Level Output Voltage1 High Level Input Current3, 4 Low Level Input Current3 Low Level Input Current4 Three-State Leakage Current5, 6, 7, 8 Three-State Leakage Current5, 9 Three-State Leakage Current9 Three-State Leakage Current7 Three-State Leakage Current10 Three-State Leakage Current8 Three-State Leakage Current6 Input Capacitance11, 12 1 Test Conditions @ VDD = min, IOH = -2.0 mA @ VDD = min, IOL = 4.0 mA2 @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = 0 V @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = 1.5 V @ VDD = max, VIN = 0 V @ VDD = max, VIN = 0 V fIN = 1 MHz, TCASE = 25C, VIN = 2.5 V 2 Min 4.1 Max 0.4 10 10 150 10 10 350 1.5 350 4.2 150 4.7 Units V V A A A A A A mA A mA A pF NOTES 11 Applies to output and bidirectional pins: DATA 47-0, ADDR 31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR 6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA. 12 See "Output Drive Currents" for typical drive current capabilities. 13 Applies to input pins: ACK SBTS, IRQ2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK. 14 Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI. 15 Applies to three-statable pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6-1, TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 k during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21062 is not requesting bus mastership.) 16 Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1. 17 Applies to CPA pin. 18 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 k during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21062L is not requesting bus mastership). 19 Applies to three-statable pins with internal pull-downs: LxDAT3-0, LxCLK, LxACK. 10 Applies to ACK pin when keeper latch enabled. 11 Applies to all signal pins. 12 Guaranteed but not tested. Specifications subject to change without notice. REV. C -13- ADSP-21062/ADSP-21062L POWER DISSIPATION ADSP-21062 (5 V) These specifications apply to the internal power portion of VDD only. See the Power Dissipation section of this data sheet for calculation of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see the technical note "SHARC Power Dissipation Measurements." Specifications are based on the following operating scenarios: Operation Instruction Type Instruction Fetch Core Memory Access Internal Memory DMA Peak Activity (IDDINPEAK) Multifunction Cache 2 per Cycle (DM and PM) 1 per Cycle High Activity (IDDINHIGH) Multifunction Internal Memory 1 per Cycle (DM) 1 per 2 Cycles Low Activity (IDDINLOW) Single Function Internal Memory None 1 per 2 Cycles To estimate power consumption for a specific application, use the following equation where % is the amount of time your program spends in that state: %PEAK x IDDINPEAK + %HIGH x IDDINHIGH + %LOW x IDDINLOW + %IDLE x IDDIDLE = power consumption Parameter IDDINPEAK IDDINHIGH IDDINLOW IDDIDLE Supply Current (Internal)1 Supply Current (Internal)2 Supply Current (Internal)2 Supply Current (Idle)3 Test Conditions tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max VDD = max Max 745 850 575 670 340 390 200 Units mA mA mA mA mA mA mA NOTES 1 The test program used to measure I DDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified. 2 IDDINHIGH is a composite average based on a range of high activity code. I DDINLOW is a composite average based on a range of low activity code. 3 Idle denotes ADSP-21062L state during execution of IDLE instruction. -14- REV. C ADSP-21062/ADSP-21062L ADSP-21062L-SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS (3.3 V) Parameter VDD TCASE VIH1 VIH2 VIL Supply Voltage Case Operating Temperature High Level Input Voltage1 High Level Input Voltage2 Low Level Input Voltage1, 2 Test Conditions A Grade Min Max 3.15 -40 2.0 2.2 -0.5 3.45 +85 VDD + 0.5 VDD + 0.5 0.8 C Grade Min Max 3.15 -40 2.0 2.2 -0.5 3.45 +100 VDD + 0.5 VDD + 0.5 0.8 K Grade Min Max 3.15 0 2.0 2.2 -0.5 3.45 +85 VDD + 0.5 VDD + 0.5 0.8 Units V C V V V @ VDD = max @ VDD = max @ VDD = min NOTES 1 Applies to input and bidirectional pins: DATA 47-0, ADDR 31-0, RD, WR, SW, ACK, SBTS, IRQ 2-0, FLAG 3-0, HBG, CS, DMAR1, DMAR2, BR6-1, ID2-0, RPBA, CPA, TFS0, TFS1, RFS0, RFS1, LxDAT3-0 , LxCLK, LxACK, EBOOT, LBOOT, BMS, TMS, TDI, TCK, HBR, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1. 2 Applies to input pins: CLKIN, RESET, TRST. ELECTRICAL CHARACTERISTICS (3.3 V) Parameter VOH VOL IIH IIL IILP IOZH IOZL IOZHP IOZLC IOZLA IOZLAR IOZLS CIN High Level Output Voltage Low Level Output Voltage1 High Level Input Current3, 4 Low Level Input Current3 Low Level Input Current4 Three-State Leakage Current5, 6, 7, 8 Three-State Leakage Current5, 9 Three-State Leakage Current9 Three-State Leakage Current7 Three-State Leakage Current10 Three-State Leakage Current8 Three-State Leakage Current6 Input Capacitance11, 12 1 Test Conditions @ VDD = min, IOH = -2.0 mA @ VDD = min, IOL = 4.0 mA2 @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = 0 V @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = VDD max @ VDD = max, VIN = 0 V @ VDD = max, VIN = 1.5 V @ VDD = max, VIN = 0 V @ VDD = max, VIN = 0 V fIN = 1 MHz, TCASE = 25C, VIN = 2.5 V 2 Min 2.4 Max 0.4 10 10 150 10 10 350 1.5 350 4.2 150 4.7 Units V V A A A A A A mA A mA A pF NOTES 11 Applies to output and bidirectional pins: DATA 47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR 6-1, CPA, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, BMS, TDO, EMU, ICSA. 12 See "Output Drive Currents" for typical drive current capabilities. 13 Applies to input pins: ACK SBTS, IRQ2-0, HBR, CS, DMAR1, DMAR2, ID2-0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK. 14 Applies to input pins with internal pull-ups: DR0, DR1, TRST, TMS, TDI. 15 Applies to three-statable pins: DATA47-0, ADDR31-0, MS3-0, RD, WR, PAGE, ADRCLK, SW, ACK, FLAG 3-0, REDY, HBG, DMAG1, DMAG2, BMS, BR6-1, TFSX, RFSX, TDO, EMU. (Note that ACK is pulled up internally with 2 k during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21062 is not requesting bus mastership.) 16 Applies to three-statable pins with internal pull-ups: DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1. 17 Applies to CPA pin. 18 Applies to ACK pin when pulled up. (Note that ACK is pulled up internally with 2 k during reset in a multiprocessor system, when ID 2-0 = 001 and another ADSP-21062L is not requesting bus mastership). 19 Applies to three-statable pins with internal pull-downs: LxDAT3-0, LxCLK, LxACK. 10 Applies to ACK pin when keeper latch enabled. 11 Applies to all signal pins. 12 Guaranteed but not tested. Specifications subject to change without notice. REV. C -15- ADSP-21062/ADSP-21062L POWER DISSIPATION ADSP-21062L (3.3 V) These specifications apply to the internal power portion of VDD only. See the Power Dissipation section of this data sheet for calculation of external supply current and total supply current. For a complete discussion of the code used to measure power dissipation, see the technical note "SHARC Power Dissipation Measurements." Specifications are based on the following operating scenarios: Operation Instruction Type Instruction Fetch Core Memory Access Internal Memory DMA Peak Activity (IDDINPEAK) Multifunction Cache 2 per Cycle (DM and PM) 1 per Cycle High Activity (IDDINHIGH) Multifunction Internal Memory 1 per Cycle (DM) 1 per 2 Cycles Low Activity (IDDINLOW) Single Function Internal Memory None 1 per 2 Cycles To estimate power consumption for a specific application, use the following equation where % is the amount of time your program spends in that state: %PEAK x IDDINPEAK + %HIGH x IDDINHIGH + %LOW x IDDINLOW + %IDLE x IDDIDLE = power consumption Parameter IDDINPEAK IDDINHIGH IDDINLOW IDDIDLE Supply Current (Internal) 1 Test Conditions tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max tCK = 30 ns, VDD = max tCK = 25 ns, VDD = max VDD = max Max 540 600 425 475 250 275 180 Units mA mA mA mA mA mA mA Supply Current (Internal)2 Supply Current (Internal)2 Supply Current (Idle)3 NOTES 1 The test program used to measure I DDINPEAK represents worst case processor operation and is not sustainable under normal application conditions. Actual internal power measurements made using typical applications are less than specified. 2 IDDINHIGH is a composite average based on a range of high activity code. I DDINLOW is a composite average based on a range of low activity code. 3 Idle denotes ADSP-21062L state during execution of IDLE instruction. -16- REV. C ADSP-21062/ADSP-21062L ABSOLUTE MAXIMUM RATINGS (5 V DEVICE)* ABSOLUTE MAXIMUM RATINGS (3.3 V DEVICE)* Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V Input Voltage . . . . . . . . . . . . . . . . . . . . -0.5 V to VDD + 0.5 V Output Voltage Swing . . . . . . . . . . . . . -0.5 V to VDD + 0.5 V Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . +280C *Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +4.6 V Input Voltage . . . . . . . . . . . . . . . . . . . . -0.5 V to VDD + 0.5 V Output Voltage Swing . . . . . . . . . . . . . -0.5 V to VDD + 0.5 V Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF Junction Temperature Under Bias . . . . . . . . . . . . . . . . 130C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Lead Temperature (5 seconds) . . . . . . . . . . . . . . . . . +280C *Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD SENSITIVITY ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADSP-21062 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE TIMING SPECIFICATIONS GENERAL NOTES Two speed grades of the ADSP-21062 will be offered, 40 MHz and 33.3 MHz. The specifications shown are based on a CLKIN frequency of 40 MHz (tCK = 25 ns). The DT derating allows specifications at other CLKIN frequencies (within the min-max range of the tCK specification; see Clock Input below). DT is the difference between the actual CLKIN period and a CLKIN period of 25 ns: DT = tCK - 25 ns Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, you cannot meaningfully add parameters to derive longer times. For voltage reference levels, see Figure 27 under Test Conditions. Switching Characteristics specify how the processor changes its signals. You have no control over this timing--circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics tell you what the processor will do in a given circumstance. You can also use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices. (O/D) = Open Drain (A/D) = Active Drive REV. C -17- ADSP-21062/ADSP-21062L Parameter Clock Input Timing Requirements: tCK CLKIN Period tCKL CLKIN Width Low CLKIN Width High tCKH tCKRF CLKIN Rise/Fall (0.4 V-2.0 V) 25 7 5 100 30 7 5 100 25 8.75 5 100 30 8.75 5 100 ns ns ns ns ADSP-21062 40 MHz 33 MHz Min Max Min Max ADSP-21062L 40 MHz 33 MHz Min Max Min Max Units 3 tCK 3 3 3 CLKIN tCKH tCKL Figure 8. Clock Input Parameter Reset Timing Requirements: tWRST RESET Pulsewidth Low1 tSRST RESET Setup Before CLKIN High2 ADSP-21062 Min Max ADSP-21062L Min Max Units 4tCK 14 + DT/2 tCK 4tCK 14 + DT/2 tCK ns ns NOTES 1 Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 2000 CLKIN cycles while RESET is low, assuming stable V DD and CLKIN (not including start-up time of external clock oscillator). 2 Only required if multiple ADSP-21062s must come out of reset synchronous to CLKIN with program counters (PC) equal (i.e., for a SIMD system). Not required for multiple ADSP-21062s communicating over the shared bus (through the external port), because the bus arbitration logic synchronizes itself automatically after reset. CLKIN tWRST RESET tSRST Figure 9. Reset Parameter Interrupts Timing Requirements: tSIR IRQ2-0 Setup Before CLKIN High1 IRQ2-0 Hold Before CLKIN High1 tHIR tIPW IRQ2-0 Pulsewidth2 NOTES 1 Only required for IRQx recognition in the following cycle. 2 Applies only if t SIR and tHIR requirements are not met. ADSP-21062 Min Max ADSP-21062L Min Max Units 18 + 3DT/4 12 + 3DT/4 2 + tCK 18 + 3DT/4 12 + 3DT/4 2 + tCK ns ns ns CLKIN tSIR tHIR IRQ2-0 tIPW Figure 10. Interrupts -18- REV. C ADSP-21062/ADSP-21062L Parameter Timer Switching Characteristic: tDTEX CLKIN High to TIMEXP ADSP-21062 Min Max ADSP-21062L Min Max Units 15 15 ns CLKIN tDTEX TIMEXP tDTEX Figure 11. Timer Parameter Flags Timing Requirements: FLAG3-0IN Setup Before CLKIN High1 tSFI tHFI FLAG3-0IN Hold After CLKIN High1 tDWRFI FLAG3-0IN Delay After RD/WR Low1 FLAG3-0IN Hold After RD/WR Deasserted1 tHFIWR Switching Characteristics: FLAG3-0OUT Delay After CLKIN High tDFO tHFO FLAG3-0OUT Hold After CLKIN High CLKIN High to FLAG3-0OUT Enable tDFOE tDFOD CLKIN High to FLAG3-0OUT Disable ADSP-21062 Min Max ADSP-21062L Min Max Units 8 + 5DT/16 0 - 5DT/16 5 + 7DT/16 0 8 + 5DT/16 0 - 5DT/16 5 + 7DT/16 0 ns ns ns ns 16 4 3 14 4 3 16 14 ns ns ns ns NOTE 1 Flag inputs meeting these setup and hold times will affect conditional instructions in the following instruction cycle. CLKIN tDFOE tDFO FLAG3-0OUT tHFO tDFO tDFOD FLAG OUTPUT CLKIN tSFI FLAG3-0IN tHFI tDWRFI RD, WR tHFIWR FLAG INPUT Figure 12. Flags REV. C -19- ADSP-21062/ADSP-21062L Memory Read--Bus Master Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) without reference to CLKIN. These specifications apply when the ADSP-21062 is the bus master accessing external memory space. These switching characteristics also apply for bus master synchronous read/write timing (see Synchronous Read/Write - Bus Master below). If these timing requirements are met, the synchronous read/write timing can be ignored (and vice versa). Parameter Min ADSP-21062 Max 18 + DT + W 12 + 5DT/8 + W Min ADSP-21062L Max 18 + DT + W 12 + 5DT/8 + W Units Timing Requirements: Address, Selects Delay to Data Valid1, 4 tDAD tDRLD RD Low to Data Valid1 tHDA Data Hold from Address, Selects2 0.5 2.0 tHDRH Data Hold from RD High2 tDAAK ACK Delay from Address, Selects3, 4 tDSAK ACK Delay from RD Low3 Switching Characteristics: tDRHA Address, Selects Hold After RD High Address, Selects to RD Low4 tDARL tRW RD Pulsewidth tRWR RD High to WR, RD, DMAGx Low tSADADC Address, Selects Setup Before ADRCLK High4 0+H 2 + 3DT/8 12.5 + 5DT/8 + W 8 + 3DT/8 + HI 0 + DT/4 0.5 2.0 14 + 7DT/8 + W 8 + DT/2 + W ns ns ns ns 14 + 7DT/8 + W ns 8 + DT/2 + W ns 0+H 2 + 3DT/8 12.5 + 5DT/8 + W 8 + 3DT/8 + HI 0 + DT/4 ns ns ns ns ns W = (number of wait states specified in WAIT register) x tCK. HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0). H = tCK (if an address hold cycle occurs as specified in WAIT register; otherwise H = 0). NOTES Data Delay/Setup: User must meet t DAD or tDRLD or synchronous spec t SSDATI. Data Hold: User must meet t HDA or tHDRH or synchronous spec tHSDATI. See System Hold Time Calculation under Test Conditions for the calculation of hold times given capacitive and dc loads. 3 ACK Delay/Setup: User must meet t DAAK or tDSAK or synchronous specification t SACKC for deassertion of ACK (Low), all three specifications must be met for assertion of ACK (High). 4 The falling edge of MSx, SW, BMS is referenced. 1 2 ADDRESS MSx, SW BMS tDARL RD tRW tDRHA tHDA tDRLD tDAD tHDRH DATA tDSAK tDAAK ACK tRWR WR, DMAG tSADADC ADRCLK (OUT) Figure 13. Memory Read--Bus Master -20- REV. C ADSP-21062/ADSP-21062L Memory Write--Bus Master Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) without reference to CLKIN. These specifications apply when the ADSP-21062 is the bus master accessing external memory space. These switching characteristics also apply for bus master synchronous read/write timing (see Synchronous Read/Write-Bus Master). If these timing requirements are met, the synchronous read/write timing can be ignored (and vice versa). Parameter Timing Requirements: ACK Delay from Address, Selects 1, 2 tDAAK tDSAK ACK Delay from WR Low1 Switching Characteristics: tDAWH Address, Selects to WR Deasserted2 Address, Selects to WR Low2 tDAWL WR Pulsewidth tWW tDDWH Data Setup Before WR High Address Hold After WR Deasserted tDWHA tDATRWH Data Disable After WR Deasserted3 tWWR WR High to WR, RD, DMAGx Low Data Disable Before WR or RD Low tDDWR WR Low to Data Enabled tWDE tSADADC Address, Selects to ADRCLK High 2 Min ADSP-21062 Max 14 + 7DT/8 + W 8 + DT/2 + W Min ADSP-21062L Max Units 14 + 7DT/8 + W ns 8 + DT/2 + W ns 17 + 15DT/16 + W 3 + 3DT/8 12 + 9DT/16 + W 7 + DT/2 + W 0.5 + DT/16 + H 1 + DT/16 + H 6 + DT/16 + H 8 + 7DT/16 + H 5 + 3DT/8 + I -1 + DT/16 0 + DT/4 17 + 15DT/16 + W 3 + 3DT/8 12 + 9DT/16 + W 7 + DT/2 + W 0.5 + DT/16 + H 1 + DT/16 + H 6 + DT/16 + H 8 + 7DT/16 + H 5 + 3DT/8 + I -1 + DT/16 0 + DT/4 ns ns ns ns ns ns ns ns ns ns W = (number of wait states specified in WAIT register) x tCK. H = tCK (if an address hold cycle occurs, as specified in WAIT register; otherwise H = 0). I = tCK (if a bus idle cycle occurs, as specified in WAIT register; otherwise I = 0). NOTES ACK Delay/Setup: User must meet t DAAK or tDSAK or synchronous specification t SACKC for deassertion of ACK (Low), all three specifications must be met for assertion of ACK (High). 2 The falling edge of MSx, SW, BMS is referenced. 3 See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads. 1 ADDRESS MSx , SW BMS tDAWH tDAWL WR tDWHA tWW tWDE tDDWH tDATRWH tWWR tDDWR DATA tDSAK tDAAK ACK RD , DMAG tSADADC ADRCLK (OUT) Figure 14. Memory Write--Bus Master REV. C -21- ADSP-21062/ADSP-21062L Synchronous Read/Write--Bus Master Use these specifications for interfacing to external memory systems that require CLKIN--relative timing or for accessing a slave ADSP-21062 (in multiprocessor memory space). These synchronous switching characteristics are also valid during asynchronous memory reads and writes (see Memory Read--Bus Master and Memory Write--Bus Master). When accessing a slave ADSP-21062, these switching characteristics must meet the slave's timing requirements for synchronous read/writes (see Synchronous Read/Write--Bus Slave). The slave ADSP-21062 must also meet these (bus master) timing requirements for data and acknowledge setup and hold times. Parameter Timing Requirements: tSSDATI Data Setup Before CLKIN tHSDATI Data Hold After CLKIN tDAAK ACK Delay After Address, MSx, SW, BMS1, 2 tSACKC ACK Setup Before CLKIN2 tHACK ACK Hold After CLKIN Switching Characteristics: tDADRO Address, MSx, BMS, SW Delay After CLKIN1 tHADRO Address, MSx, BMS, SW Hold After CLKIN PAGE Delay After CLKIN tDPGC tDRDO RD High Delay After CLKIN tDWRO WR High Delay After CLKIN tDRWL RD/WR Low Delay After CLKIN tSDDATO Data Delay After CLKIN tDATTR Data Disable After CLKIN3 tDADCCK ADRCLK Delay After CLKIN tADRCK ADRCLK Period tADRCKH ADRCLK Width High tADRCKL ADRCLK Width Low Min ADSP-21062 Max ADSP-21062L Min Max 3 + DT/8 3.5 - DT/8 Units ns ns 3 + DT/8 3.5 - DT/8 14 + 7 DT/8 + W 6.5 + DT/4 -1 - DT/4 14 + 7 DT/8 + W 6.5 + DT/4 -1 - DT/4 ns ns ns 7 - DT/8 -1 - DT/8 9 + DT/8 -2 - DT/8 -3 - 3DT/16 8 + DT/4 0 - DT/8 4 + DT/8 tCK (tCK/2 - 2) (tCK/2 - 2) -1 - DT/8 9 + DT/8 -2 - DT/8 -3 - 3DT/16 8 + DT/4 0 - DT/8 4 + DT/8 tCK (tCK/2 - 2) (tCK/2 - 2) 7 - DT/8 ns ns ns ns ns ns ns ns ns ns ns ns 16 + DT/8 4 - DT/8 4 - 3DT/16 12.5 + DT/4 19 + 5DT/16 7 - DT/8 10 + DT/8 16 + DT/8 4 - DT/8 4 - 3DT/16 12.5 + DT/4 19 + 5DT/16 7 - DT/8 10 + DT/8 W = (number of Wait states specified in WAIT register) x tCK. NOTES 1 The falling edge of MSx, SW, BMS is referenced. 2 ACK Delay/Setup: User must meet t DAAK or tDSAK or synchronous specification t SACKC for deassertion of ACK (Low), all three specifications must be met for assertion of ACK (High). 3 See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads. -22- REV. C ADSP-21062/ADSP-21062L CLKIN tADRCK tDADCCK ADRCLK tADRCKH tADRCKL tHADRO tDADRO ADDRESS MSx, SW tDAAK tDPGC PAGE tHACK tSACKC ACK (IN) READ CYCLE tDRWL RD tDRDO tHSDATI tSSDATI DATA (IN) WRITE CYCLE tDRWL WR tDWRO tSDDATO DATA (OUT) tDATTR Figure 15. Synchronous Read/Write--Bus Master REV. C -23- ADSP-21062/ADSP-21062L Synchronous Read/Write--Bus Slave Use these specifications for ADSP-21062 bus master accesses of a slave's IOP registers or internal memory (in multiprocessor memory space). The bus master must meet these (bus slave) timing requirements. Parameter Timing Requirements: tSADRI Address, SW Setup Before CLKIN Address, SW Hold Before CLKIN tHADRI tSRWLI RD/WR Low Setup Before CLKIN1 tHRWLI RD/WR Low Hold After CLKIN RD/WR Pulse High tRWHPI tSDATWH Data Setup Before WR High tHDATWH Data Hold After WR High Switching Characteristics: Data Delay After CLKIN tSDDATO Data Disable After CLKIN2 tDATTR tDACKAD ACK Delay After Address, SW3 tACKTR ACK Disable After CLKIN3 Min ADSP-21062 Max Min ADSP-21062L Max Units ns ns ns ns ns ns ns 15 + DT/2 5 + DT/2 9.5 + 5DT/16 -4 - 5DT/16 3 5 1 8 + 7DT/16 15 + DT/2 5 + DT/2 9.5 + 5DT/16 -4 - 5DT/16 3 5 1 8 + 7DT/16 0 - DT/8 -1 - DT/8 19 + 5DT/16 7 - DT/8 9 6 - DT/8 0 - DT/8 -1 - DT/8 19 + 5DT/16 7 - DT/8 9 6 - DT/8 ns ns ns ns NOTES 1 tSRWLI (min) = 9.5 + 5DT/16 when Multiprocessor Memory Space Wait State (MMSWS bit in WAIT register) is disabled; when MMSWS is enabled, t SRWLI (min) = 4 + DT/8. 2 See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads. 3 tDACKAD is true only if the address and SW inputs have setup times (before CLKIN) greater than 10 + DT/8 and less than 19 + 3DT/4. If the address and SW inputs have setup times greater than 19 + 3DT/4, then ACK is valid 14 + DT/4 (max) after CLKIN. A slave that sees an address with an M field match will respond with ACK regardless of the state of MMSWS or strobes. A slave will three-state ACK every cycle with t ACKTR. -24- REV. C ADSP-21062/ADSP-21062L CLKIN tSADRI tHADRI ADDRESS SW tDACKAD ACK tACKTR READ ACCESS RD tSRWLI tHRWLI tRWHPI tSDDATO DATA (OUT) tDATTR WRITE ACCESS WR tSRWLI tHRWLI tRWHPI tHDATWH tSDATWH DATA (IN) Figure 16. Synchronous Read/Write--Bus Slave REV. C -25- ADSP-21062/ADSP-21062L Multiprocessor Bus Request and Host Bus Request Use these specifications for passing of bus mastership between multiprocessing ADSP-21062s (BRx) or a host processor (HBR, HBG). ADSP-21062 Max 20 + 5DT/4 20 + 3DT/4 14 + 3DT/4 13 + DT/2 6 + DT/2 13 + DT/2 6 + DT/2 21 + 3DT/4 12 + 3DT/4 21 + 3DT/4 12 + 3DT/4 13 + DT/2 6 + DT/2 13 + DT/2 6 + DT/2 20 + 3DT/4 14 + 3DT/4 ADSP-21062L Min Max 20 + 5DT/4 Parameter Timing Requirements: tHBGRCSV HBG Low to RD/WR/CS Valid1 HBR Setup Before CLKIN2 tSHBRI tHHBRI HBR Hold Before CLKIN2 HBG Setup Before CLKIN tSHBGI HBG Hold Before CLKIN High tHHBGI tSBRI BRx, CPA Setup Before CLKIN3 BRx, CPA Hold Before CLKIN High tHBRI RPBA Setup Before CLKIN tSRPBAI tHRPBAI RPBA Hold Before CLKIN Switching Characteristics: HBG Delay After CLKIN tDHBGO tHHBGO HBG Hold After CLKIN BRx Delay After CLKIN tDBRO tHBRO BRx Hold After CLKIN tDCPAO CPA Low Delay After CLKIN CPA Disable After CLKIN tTRCPA tDRDYCS REDY (O/D) or (A/D) Low from CS and HBR Low4 REDY (O/D) Disable or REDY (A/D) tTRDYHG High from HBG4 tARDYTR REDY (A/D) Disable from CS or HBR High4 Min Units ns ns ns ns ns ns ns ns ns 7 - DT/8 -2 - DT/8 7 - DT/8 -2 - DT/8 -2 - DT/8 8 - DT/8 4.5 - DT/8 8.5 44 + 23DT/16 10 44 + 23DT/16 -2 - DT/8 -2 - DT/8 -2 - DT/8 7 - DT/8 7 - DT/8 8 - DT/8 4.5 - DT/8 8.75 ns ns ns ns ns ns ns ns 10 ns NOTES 1 For first asynchronous access after HBR and CS asserted, ADDR31-0 must be a non-MMS value 1/2 t CK before RD or WR goes low or by t HBGRCSV after HBG goes low. This is easily accomplished by driving an upper address signal high when HBG is asserted. See the "Host Processor Control of the ADSP-21062" section in the ADSP-21062 SHARC User's Manual, Second Edition. 2 Only required for recognition in the current cycle. 3 CPA assertion must meet the setup to CLKIN; deassertion does not need to meet the setup to CLKIN. 4 (O/D) = open drain, (A/D) = active drive. -26- REV. C ADSP-21062/ADSP-21062L CLKIN tSHBRI tHHBRI HBR tDHBGO tHHBGO HBG (OUT) tHBRO BRx (OUT) tDBRO tDCPAO CPA (OUT) (O/D) tTRCPA tSHBGI tHHBGI HBG (IN) tSBRI tHBRI BRx (IN) CPA (IN) (O/D) tSRPBAI tHRPBAI RPBA HBR AND CS tDRDYCS REDY (O/D) tTRDYHG tARDYTR REDY (A/D) tHBGRCSV HBG (OUT) RD WR CS O/D = OPEN DRAIN, A/D = ACTIVE DRIVE Figure 17. Multiprocessor Bus Request and Host Bus Request REV. C -27- ADSP-21062/ADSP-21062L Asynchronous Read/Write--Host to ADSP-21062 Use these specifications for asynchronous host processor accesses of an ADSP-21062, after the host has asserted CS and HBR (low). After HBG is returned by the ADSP-21062, the host can drive the RD and WR pins to access the ADSP-21062's internal memory or IOP registers. HBR and HBG are assumed low for this timing. Parameter Read Cycle Timing Requirements: tSADRDL Address Setup/CS Low Before RD Low1 Address Hold/CS Hold Low After RD tHADRDH RD/WR High Width tWRWH tDRDHRDY RD High Delay After REDY (O/D) Disable RD High Delay After REDY (A/D) Disable tDRDHRDY Switching Characteristics: Data Valid Before REDY Disable from Low tSDATRDY REDY (O/D) or (A/D) Low Delay After RD Low tDRDYRDL tRDYPRD REDY (O/D) or (A/D) Low Pulse Width for Read Data Disable After RD High tHDARWH Write Cycle Timing Requirements: tSCSWRL CS Low Setup Before WR low CS Low Hold After WR high tHCSWRH Address Setup Before WR High tSADWRH tHADWRH Address Hold After WR High WR Low Width tWWRL RD/WR High Width tWRWH tDWRHRDY WR High Delay After REDY (O/D) or (A/D) Disable Data Setup Before WR High tSDATWH tHDATWH Data Hold After WR High Switching Characteristics: tDRDYWRL REDY (O/D) or (A/D) Low Delay After WR/CS Low REDY (O/D) or (A/D) Low Pulse tRDYPWR Width for Write Min ADSP-21062 Max Min ADSP-21062L Max Units 0 0 6 0 0 0 0 6 0 0 ns ns ns ns ns 2 10 45 + 21DT/16 2 8 2 10 45 + 21DT/16 2 8 ns ns ns ns 0 0 5 2 7 6 0 5 1 0 0 5 2 7 6 0 5 1 ns ns ns ns ns ns ns ns ns 10 15 + 7DT/16 15 + 7DT/16 10 ns ns tSRDYCK REDY (O/D) or (A/D) Disable to CLKIN 1 + 7DT/16 8 + 7DT/16 1 + 7DT/16 8 + 7DT/16 ns NOTE 1 Not required if RD and address are valid t HBGRCSV after HBG goes low. For first access after HBR asserted, ADDR31-0 must be a non-MMS value 1/2 t CLK before RD or WR goes low or by tHBGRCSV after HBG goes low. This is easily accomplished by driving an upper address signal high when HBG is asserted. See the "Host Processor Control of the ADSP-21062" section in the ADSP-21062 SHARC User's Manual, Second Edition. CLKIN tSRDYCK REDY (O/D) REDY (A/D) O/D = OPEN DRAIN, A/D = ACTIVE DRIVE Figure 18a. Synchronous REDY Timing -28- REV. C ADSP-21062/ADSP-21062L READ CYCLE ADDRESS/CS tSADRDL RD tHADRDH tWRWH tHDARWH DATA (OUT) tSDATRDY tDRDYRDL REDY (O/D) tDRDHRDY tRDYPRD REDY (A/D) WRITE CYCLE ADDRESS tSCSWRL CS tSADWRH tHCSWRH tHADWRH tWWRL WR tWRWH tHDATWH tSDATWH DATA (IN) tDWRHRDY tDRDYWRL REDY (O/D) tRDYPWR REDY (A/D) O/D = OPEN DRAIN, A/D = ACTIVE DRIVE Figure 18b. Asynchronous Read/Write--Host to ADSP-21062 REV. C -29- ADSP-21062/ADSP-21062L Three-State Timing--Bus Master, Bus Slave, HBR, SBTS These specifications show how the memory interface is disabled (stops driving) or enabled (resumes driving) relative to CLKIN and the SBTS pin. This timing is applicable to bus master transition cycles (BTC) and host transition cycles (HTC) as well as the SBTS pin. ADSP-21062L Min Max 12 + DT/2 6 + DT/2 6 + DT/2 Parameter Timing Requirements: tSTSCK SBTS Setup Before CLKIN SBTS Hold Before CLKIN tHTSCK Switching tMIENA tMIENS tMIENHG tMITRA tMITRS tMITRHG tDATEN tDATTR tACKEN tACKTR tADCEN tADCTR tMTRHBG tMENHBG Characteristics: Address/Select Enable After CLKIN Strobes Enable After CLKIN1 HBG Enable After CLKIN Address/Select Disable After CLKIN Strobes Disable After CLKIN1 HBG Disable After CLKIN Data Enable After CLKIN2 Data Disable After CLKIN2 ACK Enable After CLKIN2 ACK Disable After CLKIN2 ADRCLK Enable After CLKIN ADRCLK Disable After CLKIN Memory Interface Disable Before HBG Low3 Memory Interface Enable After HBG High3 Min ADSP-21062 Max Units ns ns 12 + DT/2 -1 - DT/8 -1.5 - DT/8 -1.5 - DT/8 0 - DT/4 1.5 - DT/4 2.0 - DT/4 9 + 5DT/16 0 - DT/8 7.5 + DT/4 -1 - DT/8 -2 - DT/8 7 - DT/8 6 - DT/8 8 - DT/4 0 + DT/8 19 + DT -1.25 - DT/8 -1.5 - DT/8 -1.5 - DT/8 0 - DT/4 1.5 - DT/4 2.0 - DT/4 9 + 5DT/16 -0.5 - DT/8 7.5 + DT/4 -1 - DT/8 -2 - DT/8 7 - DT/8 6 - DT/8 8 - DT/4 0 + DT/8 19 + DT ns ns ns ns ns ns ns ns ns ns ns ns ns ns NOTES 1 Strobes = RD, WR, SW, PAGE, DMAG. 2 In addition to bus master transition cycles, these specs also apply to bus master and bus slave synchronous read/write. 3 Memory Interface = Address, RD, WR, MSx, SW, PAGE, DMAGx, BMS (in EPROM boot mode). CLKIN tSTSCK tHTSCK SBTS tMIENA, tMIENS, tMIENHG MEMORY INTERFACE tMITRA, tMITRS, tMITRHG tDATEN DATA tDATTR tACKEN ACK tACKTR tADCEN ADRCLK tADCTR Figure 19a. Three-State Timing (Bus Transition Cycle, SBTS Assertion) HBG tMENHBG MEMORY INTERFACE MEMORY INTERFACE = ADDRESS, RD, WR, MSx, SW, PAGE, DMAGx. BMS (IN EPROM BOOT MODE) tMTRHBG Figure 19b. Three-State Timing (Host Transition Cycle) -30- REV. C ADSP-21062/ADSP-21062L DMA Handshake These specifications describe the three DMA handshake modes. In all three modes DMAR is used to initiate transfers. For handshake mode, DMAG controls the latching or enabling of data externally. For external handshake mode, the data transfer is controlled by the ADDR31-0, RD, WR, SW, PAGE, MS3-0, ACK, and DMAG signals. For Paced Master mode, the data Parameter Timing Requirements: DMARx Low Setup Before CLKIN1 tSDRLC tSDRHC DMARx High Setup Before CLKIN1 tWDR DMARx Width Low (Nonsynchronous) tSDATDGL Data Setup After DMAGx Low2 tHDATIDG Data Hold After DMAGx High tDATDRH Data Valid After DMARx High2 tDMARLL DMARx Low Edge to Low Edge tDMARH DMARx Width High Switching Characteristics: DMAGx Low Delay After CLKIN tDDGL DMAGx High Width tWDGH tWDGL DMAGx Low Width tHDGC DMAGx High Delay After CLKIN tVDATDGH Data Valid Before DMAGx High3 tDATRDGH Data Disable After DMAGx High4 tDGWRL WR Low Before DMAGx Low tDGWRH DMAGx Low Before WR High tDGWRR WR High Before DMAGx High tDGRDL RD Low Before DMAGx Low RD Low Before DMAGx High tDRDGH tDGRDR RD High Before DMAGx High tDGWR DMAGx High to WR, RD, DMAGx Low Address/Select Valid to DMAGx High tDADGH tDDGHA Address/Select Hold after DMAGx High Min 5 5 6 transfer is controlled by ADDR31-0, RD, WR, MS3-0, and ACK (not DMAG). For Paced Master mode, the Memory Read-Bus Master, Memory Write-Bus Master, and Synchronous Read/ Write-Bus Master timing specifications for ADDR31-0, RD, WR, MS3-0, SW, PAGE, DATA47-0, and ACK also apply. ADSP-21062 Max Min 5 5 6 ADSP-21062L Max Units ns ns ns ns ns ns ns ns 10 + 5DT/8 2 16 + 7DT/8 23 + 7DT/8 6 23 + 7DT/8 6 2 10 + 5DT/8 16 + 7DT/8 9 + DT/4 6 + 3DT/8 12 + 5DT/8 -2 - DT/8 8 + 9DT/16 0 -0.25 10 + 5DT/8 + W 1 + DT/16 0 11 + 9DT/16 + W 0 5 + 3DT/8 + HI 17 + DT -0.5 15 + DT/4 6 - DT/8 7 2 3 + DT/16 2 3 9 + DT/4 6 + 3DT/8 12 + 5DT/8 -2 - DT/8 8 + 9DT/16 0 -0.25 10 + 5DT/8 + W 1 + DT/16 0 11 + 9DT/16 + W 0 5 + 3DT/8 + HI 17 + DT -1 15 + DT/4 6 - DT/8 7 2 3 + DT/16 2 3 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns W = (number of wait states specified in WAIT register) x tCK. HI = tCK (if an address hold cycle or bus idle cycle occurs, as specified in WAIT register; otherwise HI = 0). NOTES 1 Only required for recognition in the current cycle. 2 tSDATDGL is the data setup requirement if DMARx is not being used to hold off completion of a write. Otherwise, if DMARx low holds off completion of the write, the data can be driven tDATDRH after DMARx is brought high. 3 tVDATDGH is valid if DMARx is not being used to hold off completion of a read. If DMARx is used to prolong the read, then t VDATDGH = 8 + 9DT/16 + (n x tCK) where n equals the number of extra cycles that the access is prolonged. 4 See System Hold Time Calculation under Test Conditions for calculation of hold times given capacitive and dc loads. REV. C -31- ADSP-21062/ADSP-21062L CLKIN tSDRLC tDMARLL tSDRHC tWDR DMARx tDMARH tDDGL DMAGx tHDGC tWDGL tWDGH TRANSFERS BETWEEN ADSP-2106x INTERNAL MEMORY AND EXTERNAL DEVICE tVDATDGH DATA (FROM ADSP-2106x TO EXTERNAL DRIVE) tDATRDGH tDATDRH tSDATDGL DATA (FROM EXTERNAL DRIVE TO ADSP-2106x) tHDATIDG TRANSFERS BETWEEN EXTERNAL DEVICE AND EXTERNAL MEMORY* (EXTERNAL HANDSHAKE MODE) WR (EXTERNAL DEVICE TO EXTERNAL MEMORY) RD (EXTERNAL MEMORY TO EXTERNAL DEVICE) tDGWRL tDGWRH tDGWRR tDGRDL tDGRDR tDRDGH tDADGH tDDGHA ADDRESS MSx, SW *MEMORY READ - BUS MASTER, MEMORY WRITE - BUS MASTER, AND SYNCHRONOUS READ/WRITE - BUS MASTER TIMING SPECIFICATIONS FOR ADDR31-0, RD, WR, SW, MS3-0 AND ACK ALSO APPLY HERE. Figure 20. DMA Handshake Timing -32- REV. C ADSP-21062/ADSP-21062L Link Ports: 1 CLK Speed Operation Parameter Receive Timing Requirements: tSLDCL Data Setup Before LCLK Low tHLDCL Data Hold After LCLK Low LCLK Period (1 x Operation) tLCLKIW tLCLKRWL LCLK Width Low tLCLKRWH LCLK Width High Switching Characteristics: LACK High Delay After CLKIN High tDLAHC LACK Low Delay After LCLK High1 tDLALC tENDLK LACK Enable from CLKIN tTDLK LACK Disable from CLKIN Transmit Timing Requirements: LACK Setup Before LCLK High tSLACH tHLACH LACK Hold After LCLK High Switching Characteristics: LCLK Delay After CLKIN (1 x operation) tDLCLK tDLDCH Data Delay After LCLK High Data Hold After LCLK High tHLDCH tLCLKTWL LCLK Width Low tLCLKTWH LCLK Width High LCLK Low Delay After LACK High tDLACLK tENDLK LDAT, LCLK Enable After CLKIN tTDLK LDAT, LCLK Disable After CLKIN Link Port Service Request Interrupts: 1 x and 2 x Speed Operations Timing Requirements: LACK/LCLK Setup Before CLKIN Low2 tSLCK tHLCK LACK/LCLK Hold After CLKIN Low2 Min ADSP-21062 Max Min ADSP-21062L Max Units 3 3 tCK 6 5 3 3 tCK 6 5 ns ns ns ns ns 18 + DT/2 -3 5 + DT/2 28.5 + DT/2 13 20 + DT/2 18 + DT/2 -3 5 + DT/2 28.5 + DT/2 13 20 + DT/2 ns ns ns ns 18 -7 18 -7 ns ns 15.5 2.5 -3 (tCK/2) - 1 (tCK/2) - 1.25 (tCK/2) + 8.75 5 + DT/2 -3 (tCK/2) + 1.25 (tCK/2) - 1 (tCK/2) + 1 (tCK/2) - 1.5 (3 x tCK/2) + 17 (tCK/2) + 8 5 + DT/2 20 + DT/2 ns ns ns (tCK/2) + 1.5 ns (tCK/2) + 1 ns (3 x tCK/2) + 17 ns ns 20 + DT/2 ns 15.5 2.5 10 2 10 2 ns ns NOTES 1 LACK will go low with t DLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver's link buffer is not about to fill. 2 Only required for interrupt recognition in the current cycle. REV. C -33- ADSP-21062/ADSP-21062L Link Ports: 2 CLK Speed Operation Calculation of link receiver data setup and hold relative to link clock is required to determine the maximum allowable skew that can be introduced in the transmission path between LDATA and LCLK. Setup skew is the maximum delay that can be introduced in LDATA relative to LCLK, (setup skew = tLCLKTWH min - tDLDCH - tSLDCL). Hold skew is the maximum delay that can be introduced in LCLK relative to LDATA, (hold skew = tLCLKTWL min - tHLDCH - tHLDCL). Calculations made directly from 2 x speed specifications will result in unrealistically small skew times because they include multiple tester guardbands. The setup and hold skew times shown below are calculated to include only one tester guardband. ADSP-21062 Setup Skew ADSP-21062 Hold Skew = 1.84 ns max = 2.78 ns max ADSP-21062L Setup Skew = 2.10 ns max ADSP-21062L Hold Skew = 1.87 ns max ADSP-21062L Max Parameter Receive Timing Requirements: tSLDCL Data Setup Before LCLK Low Data Hold After LCLK Low tHLDCL tLCLKIW LCLK Period (2 x Operation) tLCLKRWL LCLK Width Low tLCLKRWH LCLK Width High Switching Characteristics: LACK High Delay After CLKIN High tDLAHC tDLALC LACK Low Delay After LCLK High1 Transmit Timing Requirements: LACK Setup Before LCLK High tSLACH LACK Hold After LCLK High tHLACH Switching Characteristics: LCLK Delay After CLKIN tDLCLK tDLDCH Data Delay After LCLK High tHLDCH Data Hold After LCLK High tLCLKTWL LCLK Width Low tLCLKTWH LCLK Width High tDLACLK LCLK Low Delay After LACK High Min ADSP-21062 Max Min Units 2.5 2.25 tCK/2 4.5 4 2.25 2.25 tCK/2 5.25 4 ns ns ns ns ns 18 + DT/2 6 28.5 + DT/2 16 18 + DT/2 6 29.5 + DT/2 16 ns ns 19 -6.75 19 -6.5 ns ns 8 2.25 -2.0 (tCK/4) - 1 (tCK/4) + 1.25 (tCK/4) - 1.25 (tCK/4) + 1 (tCK/4) + 9 (3 x tCK/4) + 16.5 -2.25 (tCK/4) - 1 (tCK/4) - 1.5 (tCK/4) + 9 8 2.25 (tCK/4) + 1.5 (tCK/4) + 1 (3 x tCK/4) + 16.5 ns ns ns ns ns ns NOTE 1 LACK will go low with t DLALC relative to rising edge of LCLK after first nibble is received. LACK will not go low if the receiver's link buffer is not about to fill. -34- REV. C ADSP-21062/ADSP-21062L TRANSMIT CLKIN tDLCLK tLCLKTWH LCLK 1x OR LCLK 2x tLCLKTWL LAST NIBBLE TRANSMITTED FIRST NIBBLE TRANSMITTED LCLK INACTIVE (HIGH) tDLDCH tHLDCH LDAT(3:0) OUT tDLACLK tSLACH LACK (IN) THE tSLACH REQUIREMENT APPLIES TO THE RISING EDGE OF LCLK ONLY FOR THE FIRST NIBBLE TRANSMITTED. tHLACH RECEIVE CLKIN tLCLKIW tLCLKRWH LCLK 1x OR LCLK 2x tLCLKRWL tHLDCL tSLDCL LDAT(3:0) IN tDLAHC LACK (OUT) tDLALC LINK PORT ENABLE/THREE-STATE DELAY FROM INSTRUCTION CLKIN tENDLK LCLK LDAT(3:0) LACK t TDLK LINK PORT ENABLE OR THREE-STATE TAKES EFFECT TWO CYCLES AFTER A WRITE TO A LINK PORT CONTROL REGISTER. LINK PORT INTERRUPT SETUP TIME CLKIN tSLCK LCLK LACK t HLCK Figure 21. Link Ports REV. C -35- ADSP-21062/ADSP-21062L Serial Ports Parameter External Clock Timing Requirements: TFS/RFS Setup Before TCLK/RCLK 1 tSFSE TFS/RFS Hold After TCLK/RCLK 1, 2 tHFSE Receive Data Setup Before RCLK 1 tSDRE Receive Data Hold After RCLK 1 tHDRE TCLK/RCLK Width tSCLKW tSCLK TCLK/RCLK Period Internal Clock Timing Requirements: TFS Setup Before TCLK 1; RFS Setup tSFSI Before RCLK1 TFS/RFS Hold After TCLK/RCLK 1, 2 tHFSI tSDRI Receive Data Setup Before RCLK 1 Receive Data Hold After RCLK 1 tHDRI External or Internal Clock Switching Characteristics: RFS Delay After RCLK (Internally tDFSE Generated RFS)3 RFS Hold After RCLK (Internally tHOFSE Generated RFS)3 External Clock Switching Characteristics: TFS Delay After TCLK (Internally tDFSE Generated TFS)3 TFS Hold After TCLK (Internally tHOFSE Generated TFS)3 tDDTE Transmit Data Delay After TCLK 3 Transmit Data Hold After TCLK 3 tHDTE Internal Clock Switching Characteristics: TFS Delay After TCLK (Internally tDFSI Generated TFS)3 tHOFSI TFS Hold After TCLK (Internally Generated TFS)3 Transmit Data Delay After TCLK 3 tDDTI Transmit Data Hold After TCLK 3 tHDTI TCLK/RCLK Width tSCLKIW Enable and Three-State Switching Characteristics: Data Enable from External TCLK 3 tDDTEN tDDTTE Data Disable from External TCLK 3 Data Enable from Internal TCLK 3 tDDTIN Data Disable from Internal TCLK 3 tDDTTI TCLK/RCLK Delay from CLKIN tDCLK SPORT Disable After CLKIN tDPTR Gated SCLK with External TFS (Mesh Multiprocessing)4 Timing Requirements: TFS Setup Before CLKIN tSTFSCK TFS Hold After CLKIN tHTFSCK External Late Frame Sync Switching Characteristics: tDDTLFSE Data Delay from Late External TFS or External RFS with MCE = 1, MFD = 0 5 tDDTENFS Data Enable from late FS or MCE = 1, MFD = 05 Min ADSP-21062 Max Min ADSP-21062L Max Units 3.5 4 1.5 4 9 tCK 3.5 4 1.5 4 9 tCK ns ns ns ns ns ns 8 1 3 3 8 1 3 3 ns ns ns ns 13 3 3 13 ns ns 13 3 16 5 5 3 13 ns ns ns ns 16 4.5 -1.5 7.5 0 (tSCLK/2) - 2.5 (tSCLK/2) + 2.5 0 (tSCLK/2) - 2.5 -1.5 4.5 ns ns ns ns ns 7.5 (tSCLK/2) + 2.5 4.25 10.5 0 3 22 + 3DT/8 17 4 16 0 7.5 22 + 3DT/8 17 ns ns ns ns ns ns 5 tCK/2 5 tCK/2 ns ns 12.75 3.5 3.5 12.75 ns ns To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) SCLK width. -36- REV. C ADSP-21062/ADSP-21062L NOTES 1 Referenced to sample edge. 2 RFS hold after RCK when MCE = 1, MFD = 0 is 0 ns minimum from drive edge. TFS hold after TCK for late external TFS is 0 ns minimum from drive edge. 3 Referenced to drive edge. 4 Applies only to gated serial clock mode used for serial port system I/O in mesh multiprocessing systems. 5 MCE = 1, TFS enable and TFS valid follow t DDTLFSE and tDDTENFS . DATA RECEIVE- INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DATA RECEIVE- EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE tSCLKIW RCLK RCLK tSCLKW tHOFSE RFS tDFSE tSFSI tHFSI RFS tDFSE tHOFSE tSFSE tHFSE tSDRI DR tHDRI DR tSDRE tHDRE NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE. DATA TRANSMIT- INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DATA TRANSMIT- EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE tSCLKIW TCLK TCLK tSCLKW tHOFSI TFS tDFSI tSFSI tHFSI TFS tDFSE tHOFSE tSFSE tHFSE tHDTI DT tDDTI tHDTE DT tDDTE NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF RCLK, TCLK CAN BE USED AS THE ACTIVE SAMPLING EDGE. DRIVE EDGE DRIVE EDGE TCLK (EXT) TCLK / RCLK tDDTEN DT DRIVE EDGE DRIVE EDGE tDDTTE TCLK (INT) TCLK / RCLK tDDTIN tDDTTI DT CLKIN CLKIN tDPTR TCLK, RCLK TFS, RFS, DT SPORT DISABLE DELAY FROM INSTRUCTION SPORT ENABLE AND THREE-STATE LATENCY IS TWO CYCLES tSTFSCK TFS (EXT) tHTFSCK tDCLK TCLK (INT) RCLK (INT) LOW TO HIGH ONLY NOTE: APPLIES ONLY TO GATED SERIAL CLOCK MODE WITH EXTERNAL TFS, AS USED IN THE SERIAL PORT SYSTEM I/O FOR MESH MULTIPROCESSING. Figure 22. Serial Ports REV. C -37- ADSP-21062/ADSP-21062L EXTERNAL RFS with MCE = 1, MFD = 0 DRIVE RCLK SAMPLE DRIVE tHOFSE/I tSFSE/I RFS (SEE NOTE 2 ON PREVIOUS PAGE) tDDTE/I tDDTENFS DT tHDTE/I 1ST BIT 2ND BIT tDDTLFSE LATE EXTERNAL TFS DRIVE TCLK SAMPLE DRIVE tHOFSE/I tSFSE/I TFS (SEE NOTE 2 ON PREVIOUS PAGE) tDDTE/I tDDTENFS DT tHDTE/I 1ST BIT 2ND BIT tDDTLFSE Figure 23. External Late Frame Sync -38- REV. C ADSP-21062/ADSP-21062L JTAG Test Access Port and Emulation Parameter Timing Requirements: tTCK TCK Period tSTAP TDI, TMS Setup Before TCK High TDI, TMS Hold After TCK High tHTAP tSSYS System Inputs Setup Before TCK Low1 tHSYS System Inputs Hold After TCK Low1 TRST Pulsewidth tTRSTW Switching Characteristics: TDO Delay from TCK Low tDTDO tDSYS System Outputs Delay After TCK Low2 ADSP-21062 Min Max tCK 5 6 7 18 4tCK 13 18.5 ADSP-21062L Min Max tCK 5 6 7 18.5 4tCK 13 18.5 Units ns ns ns ns ns ns ns ns NOTES 1 System Inputs = DATA 47-0, ADDR 31-0, RD, WR, ACK, SBTS, SW, HBR, HBG, CS, DMAR1, DMAR2, BR 6-1, ID2-0, RPBA, IRQ 2-0, FLAG 3-0, DR0, DR1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT 3-0, LxCLK, LxACK, EBOOT, LBOOT, BMS, CLKIN, RESET. 2 System Outputs = DATA 47-0, ADDR 31-0, MS3-0, RD, WR, ACK, PAGE, ADRCLK, SW, HBG, REDY, DMAG1, DMAG2, BR 6-1, CPA, FLAG3-0, TIMEXP, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT3-0, LxCLK, LxACK, BMS. tTCK TCK tSTAP TMS TDI tHTAP tDTDO TDO tSSYS SYSTEM INPUTS tHSYS tDSYS SYSTEM OUTPUTS Figure 24. IEEE 11499.1 JTAG Test Access Port REV. C -39- ADSP-21062/ADSP-21062L OUTPUT DRIVE CURRENTS Table III. External Power Calculations (3.3 V Device) Pin Type Address MS0 WR Data ADDRCLK # of Pins 15 1 1 32 1 % Switching 50 0 - 50 - C x 44.7 pF x 44.7 pF x 44.7 pF x 14.7 pF x 4.7 pF f x 10 MHz x 10 MHz x 20 MHz x 10 MHz x 20 MHz VDD2 = PEXT x 10.9 V x 10.9 V x 10.9 V x 10.9 V x 10.9 V = 0.037 W = 0.000 W = 0.010 W = 0.026 W = 0.001 W Figure 28 shows typical I-V characteristics for the output drivers of the ADSP-21062. The curves represent the current drive capability of the output drivers as a function of output voltage. POWER DISSIPATION Total power dissipation has two components, one due to internal circuitry and one due to the switching of external output drivers. Internal power dissipation is dependent on the instruction execution sequence and the data operands involved. Internal power dissipation is calculated in the following way: PINT = IDDIN x VDD The external component of total power dissipation is caused by the switching of output pins. Its magnitude depends on: - the number of output pins that switch during each cycle (O) - the maximum frequency at which they can switch (f) - their load capacitance (C) - their voltage swing (VDD) and is calculated by: PEXT = O x C x VDD2 x f The load capacitance should include the processor's package capacitance (CIN). The switching frequency includes driving the load high and then back low. Address and data pins can drive high and low at a maximum rate of 1/(2tCK). The write strobe can switch every cycle at a frequency of 1/tCK. Select pins switch at 1/(2tCK), but selects can switch on each cycle. Example: Estimate PEXT with the following assumptions: -A system with one bank of external data memory RAM (32-bit) -Four 128K x 8 RAM chips are used, each with a load of 10 pF -External data memory writes occur every other cycle, a rate of 1/(4tCK), with 50% of the pins switching -The instruction cycle rate is 40 MHz (tCK = 25 ns). The PEXT equation is calculated for each class of pins that can drive: Table II. External Power Calculations (5 V Device) Pin Type Address MS0 WR Data ADDRCLK # of Pins 15 1 1 32 1 % Switching 50 0 - 50 - C x 44.7 pF x 44.7 pF x 44.7 pF x 14.7 pF x 4.7 pF f x 10 MHz x 10 MHz x 20 MHz x 10 MHz x 20 MHz VDD2 = PEXT x 25 V x 25 V x 25 V x 25 V x 25 V = 0.084 W = 0.000 W = 0.022 W = 0.059 W = 0.002 W PEXT = 0.074 W A typical power consumption can now be calculated for these conditions by adding a typical internal power dissipation: PTOTAL = PEXT + (IDDIN2 x 5.0 V ) Note that the conditions causing a worst-case PEXT are different from those causing a worst-case PINT. Maximum PINT cannot occur while 100% of the output pins are switching from all ones to all zeros. Note also that it is not common for an application to have 100% or even 50% of the outputs switching simultaneously. TEST CONDITIONS Output Disable Time Output pins are considered to be disabled when they stop driving, go into a high impedance state, and start to decay from their output high or low voltage. The time for the voltage on the bus to decay by V is dependent on the capacitive load, CL and the load current, IL. This decay time can be approximated by the following equation: t DECAY = C L V IL The output disable time tDIS is the difference between tMEASURED and tDECAY as shown in Figure 25. The time tMEASURED is the interval from when the reference signal switches to when the output voltage decays V from the measured output high or output low voltage. tDECAY is calculated with test loads CL and IL, and with V equal to 0.5 V. Output Enable Time Output pins are considered to be enabled when they have made a transition from a high impedance state to when they start driving. The output enable time tENA is the interval from when a reference signal reaches a high or low voltage level to when the output has reached a specified high or low trip point, as shown in the Output Enable/Disable diagram (Figure 25). If multiple pins (such as the data bus) are enabled, the measurement value is that of the first pin to start driving. PEXT = 0.167 W -40- REV. C ADSP-21062/ADSP-21062L Example System Hold Time Calculation IOL To determine the data output hold time in a particular system, first calculate tDECAY using the equation given above. Choose V to be the difference between the ADSP-21062's output voltage and the input threshold for the device requiring the hold time. A typical V will be 0.4 V. CL is the total bus capacitance (per data line), and IL is the total leakage or three-state current (per data line). The hold time will be tDECAY plus the minimum disable time (i.e., tDATRWH for the write cycle). REFERENCE SIGNAL TO OUTPUT PIN +1.5V 50pF IOH tMEASURED tDIS VOH (MEASURED) VOH (MEASURED) - V VOL (MEASURED) VOL (MEASURED) + V Figure 26. Equivalent Device Loading for AC Measurements (Includes All Fixtures) tENA VOH (MEASURED) Capacitive Loading 2.0V 1.0V tDECAY OUTPUT STOPS DRIVING VOL (MEASURED) OUTPUT STARTS DRIVING HIGH-IMPEDANCE STATE. TEST CONDITIONS CAUSE THIS VOLTAGE TO BE APPROXIMATELY 1.5V Figure 25. Output Enable/Disable Output delays and holds are based on standard capacitive loads: 50 pF on all pins (see Figure 26). The delay and hold specifications given should be derated by a factor of 1.5 ns/50 pF for loads other than the nominal value of 50 pF. Figures 29-30, 33-34 show how output rise time varies with capacitance. Figures 31, 35 show graphically how output delays and holds vary with load capacitance. (Note that this graph or derating does not apply to output disable delays; see the previous section Output Disable Time under Test Conditions.) The graphs of Figures 29, 30 and 31 may not be linear outside the ranges shown. INPUT OR OUTPUT 1.5V 1.5V Figure 27. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) REV. C -41- ADSP-21062/ADSP-21062L 100 75 OUTPUT DELAY OR HOLD - ns 5 50 SOURCE CURRENT - mA 4 25 0 -25 -50 -75 -100 -125 -150 -175 -200 0 0.75 5.25V, -40 C 5.0V, +25C 4.75V, +85C 3 Y = 0.03X -1.45 2 4.75V, +85C 5.0V, +25C 5.25V, -40C 1 NOMINAL -1 1.50 2.25 3.00 3.75 SOURCE VOLTAGE - V 4.50 5.25 25 50 75 100 125 150 LOAD CAPACITANCE - pF 175 200 Figure 28. ADSP-21062 Typical Drive Currents (VDD = 5 V) Figure 31. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (VDD = 5 V) 16.0 14.0 RISE AND FALL TIMES - ns (0.5V - 4.5V, 10% - 90%) 120 100 80 3.3V, +25C 3.6V, -40C 3.0V, +85 C 12.0 RISE TIME 10.0 8.0 6.0 4.0 2.0 0 Y = 0.0031X + 1.1 Y = 0.005X + 3.7 FALL TIME SOURCE CURRENT - mA 60 40 20 0 -20 -40 -60 -80 3.0V, +85C VOH 3.3V, +25C 3.6V, -40C -100 -120 VOL 0 0.5 1 1.5 2 2.5 SOURCE VOLTAGE - V 3 3.5 0 20 40 60 80 100 120 140 LOAD CAPACITANCE - pF 160 180 200 Figure 29. Typical Output Rise Time (10%-90% VDD) vs. Load Capacitance (VDD = 5 V) Figure 32. ADSP-21062 Typical Drive Currents (VDD = 3.3 V) 3.5 RISE AND FALL TIMES - ns (10% - 90%) 18 16 14 Y = 0.0796X + 1.17 12 10 RISE TIME 8 6 4 2 0 FALL TIME Y = 0.0467X + 0.55 RISE AND FALL TIMES - ns (0.8V - 2.0V) 3.0 2.5 RISE TIME 2.0 Y = 0.009X + 1.1 1.5 1.0 Y = 0.005X + 0.6 0.5 0 FALL TIME 0 20 40 60 80 100 120 140 LOAD CAPACITANCE - pF 160 180 200 0 20 40 60 80 100 120 140 160 180 200 LOAD CAPACITANCE - pF Figure 30. Typical Output Rise Time (0.8 V-2.0 V) vs. Load Capacitance (VDD = 5 V) Figure 33. Typical Output Rise Time (10%-90% VDD) vs. Load Capacitance (VDD = 3.3 V) -42- REV. C ADSP-21062/ADSP-21062L 9 RISE AND FALL TIMES - ns (0.8V - 2.0V) 8 7 6 5 4 3 2 1 0 FALL TIME RISE TIME Y = 0.0305X + 0.24 Y = 0.0391X + 0.36 ENVIRONMENTAL CONDITIONS Thermal Characteristics The ADSP-21062 is available in 240-lead thermally enhanced MQFP and 225-lead plastic ball grid array packages. The top surface of the thermally enhanced MQFP contains a copper slug from which most of the die heat is dissipated. The slug is flush with the top surface of the package. Note that the copper slug is internally connected to GND through the device substrate. Both packages are specified for a case temperature (TCASE). To ensure that the TCASE is not exceeded, a heatsink and/or an air flow source may be used. A heatsink should be attached with a thermal adhesive. 0 20 40 60 80 100 120 140 160 180 200 TCASE = TAMB + ( PD x CA ) TCASE = Case temperature (measured on top surface of package) PD = Power dissipation in W (this value depends upon the specific application; a method for calculating PD is shown under Power Dissipation). CA = Value from table below. 240 MQFP LOAD CAPACITANCE - pF Figure 34. Typical Output Rise Time (0.8 V-2.0 V) vs. Load Capacitance (VDD = 3.3 V) 5 OUTPUT DELAY OR HOLD - ns 4 Y = 0.0329X -1.65 3 JC = 0.3 C/W Airflow (Linear Ft./Min.) 0 10 100 9 200 8 400 7 600 6 2 CA (C/W) 1 NOTES This represents thermal resistance at total power of 5 W. With air flow, no variance is seen in CA with power. CA at 0 LFM varies with power: at 2W, CA = 14C/W, at 3W CA = 11C/W. NOMINAL 225 PBGA -1 25 50 75 100 125 150 LOAD CAPACITANCE - pF 175 200 Figure 35. Typical Output Delay or Hold vs. Load Capacitance (at Maximum Case Temperature) (VDD = 3.3 V) JC = 1.7 C/W Airflow (Linear Ft./Min.) 0 20.7 200 15.3 400 12.9 CA (C/W) NOTE No variance is seen in CA with power. REV. C -43- ADSP-21062/ADSP-21062L 225-Ball Plastic Ball Grid Array (PBGA) Package Descriptions Ball # A01 A02 A03 A04 A05 A06 A07 A08 A09 A10 A11 A12 A13 A14 A15 B01 B02 B03 B04 B05 B06 B07 B08 B09 B10 B11 B12 B13 B14 B15 C01 C02 C03 C04 C05 C06 C07 C08 C09 C10 C11 C12 C13 C14 C15 Name BMS ADDR30 DMAR2 DT1 RCLK1 TCLK0 RCLK0 ADRCLK CS CLKIN PAGE BR3 DATA47 DATA44 DATA42 MS0 SW ADDR31 HBR DR1 DT0 DR0 REDY RD ACK BR6 BR2 DATA45 DATA43 DATA39 MS3 MS1 ADDR28 SBTS TCLK1 RFS1 TFS0 RFS0 WR DMAG1 BR4 DATA46 DATA41 DATA38 DATA36 Ball # D01 D02 D03 D04 D05 D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 E01 E02 E03 E04 E05 E06 E07 E08 E09 E10 E11 E12 E13 E14 E15 F01 F02 F03 F04 F05 F06 F07 F08 F09 F10 F11 F12 F13 F14 F15 Name ADDR25 ADDR26 MS2 ADDR29 DMAR1 TFS1 CPA HBG DMAG2 BR5 BR1 DATA40 DATA37 DATA35 DATA34 ADDR21 ADDR22 ADDR24 ADDR27 GND GND GND GND GND GND NC DATA33 DATA30 DATA32 DATA31 ADDR17 ADDR18 ADDR20 ADDR23 GND GND VDD VDD VDD GND GND DATA29 DATA26 DATA28 DATA27 Ball # G01 G02 G03 G04 G05 G06 G07 G08 G09 G10 G11 G12 G13 G14 G15 H01 H02 H03 H04 H05 H06 H07 H08 H09 H10 H11 H12 H13 H14 H15 J01 J02 J03 J04 J05 J06 J07 J08 J09 J10 J11 J12 J13 J14 J15 Name ADDR14 ADDR15 ADDR16 ADDR19 GND VDD VDD VDD VDD VDD GND DATA22 DATA25 DATA24 DATA23 ADDR12 ADDR11 ADDR13 ADDR10 GND VDD VDD VDD VDD VDD GND DATA18 DATA19 DATA21 DATA20 ADDR9 ADDR8 ADDR7 ADDR4 GND VDD VDD VDD VDD VDD GND DATA12 DATA15 DATA16 DATA17 Ball # K01 K02 K03 K04 K05 K06 K07 K08 K09 K10 K11 K12 K13 K14 K15 L01 L02 LA03 L04 L05 L06 L07 L08 L09 L10 L11 L12 L13 L14 L15 M01 M02 M03 M04 M05 M06 M07 M08 M09 M10 M11 M12 M13 M14 M15 Name ADDR6 ADDR5 ADDR3 ADDR0 ICSA GND VDD VDD VDD GND GND DATA8 DATA11 DATA13 DATA14 ADDR2 ADDR1 FLAG0 FLAG3 RPBA GND GND GND GND GND NC DATA4 DATA7 DATA9 DATA10 FLAG1 FLAG2 TIMEXP TDI LBOOT L5ACK L5DAT2 L4DAT2 L3DAT0 L2DAT3 L1DAT1 L0DAT0 DATA2 DATA5 DATA6 Ball # N01 N02 N03 N04 N05 N06 N07 N08 N09 N10 N11 N12 N13 N14 N15 P01 P02 P03 P04 P05 P06 P07 P08 P09 P10 P11 P12 P13 P14 P15 R01 R02 R03 R04 R05 R06 R07 R08 R09 R10 R11 R12 R13 R14 R15 Name EMU TDO IRQ0 IRQ1 ID2 L5DAT1 L4CLK L3CLK L3DAT3 L2DAT0 L1ACK L1DAT3 L0DAT3 DATA1 DATA3 TRST TMS EBOOT ID0 L5CLK L5DAT3 L4DAT0 L4DAT3 L3DAT2 L2CLK L2DAT2 L1DAT0 L0ACK L0DAT1 DATA0 TCK IRQ2 RESET ID1 L5DAT0 L4ACK L4DAT1 L3ACK L3DAT1 L2ACK L2DAT1 L1CLK L1DAT2 L0CLK L0DAT2 -44- REV. C ADSP-21062/ADSP-21062L 225-Ball Plastic Ball Grid Array (PBGA) Package Pinout 15 14 13 12 BR3 11 PAGE 10 CLKIN 9 CS 8 ADRCLK 7 RCLK0 6 TCLK0 5 RCLK1 4 DT1 3 DMAR2 2 ADDR30 1 BMS DATA42 DATA44 DATA47 A B C D E F G H J K L M N P R DATA39 DATA43 DATA45 BR2 BR6 ACK RD REDY DR0 DT0 DR1 HBR ADDR31 SW MS0 DATA36 DATA38 DATA41 DATA46 BR4 DMAG1 WR RFS0 TFS0 RFS1 TCLK1 SBTS ADDR28 MS1 MS3 DATA34 DATA35 DATA37 DATA40 BR1 BR5 DMAG2 HBG CPA TFS1 DMAR1 ADDR29 MS2 ADDR26 ADDR25 DATA31 DATA32 DATA30 DATA33 NC GND GND GND GND GND GND ADDR27 ADDR24 ADDR22 ADDR21 DATA27 DATA28 DATA26 DATA29 GND GND VDD VDD VDD GND GND ADDR23 ADDR20 ADDR18 ADDR17 DATA23 DATA24 DATA25 DATA22 GND VDD VDD VDD VDD VDD GND ADDR19 ADDR16 ADDR15 ADDR14 DATA20 DATA21 DATA19 DATA18 GND VDD VDD VDD VDD VDD GND ADDR10 ADDR13 ADDR11 ADDR12 DATA17 DATA16 DATA15 DATA12 GND VDD VDD VDD VDD VDD GND ADDR4 ADDR7 ADDR8 ADDR9 DATA14 DATA13 DATA11 DATA8 GND GND VDD VDD VDD GND ICSA ADDR0 ADDR3 ADDR5 ADDR6 DATA10 DATA9 DATA7 DATA4 NC GND GND GND GND GND RPBA FLAG3 FLAG0 ADDR1 ADDR2 DATA6 DATA5 DATA2 L0DAT0 L1DAT1 L2DAT3 L3DAT0 L4DAT2 L5DAT2 L5ACK LBOOT TDI TIMEXP FLAG2 FLAG1 DATA3 DATA1 L0DAT3 L1DAT3 L1ACK L2DAT0 L3DAT3 L3CLK L4CLK L5DAT1 ID2 IRQ1 IRQ0 TDO EMU DATA0 L0DAT1 L0ACK L1DAT0 L2DAT2 L2CLK L3DAT2 L4DAT3 L4DAT0 L5DAT3 L5CLK ID0 EBOOT TMS TRST L0DAT2 L0CLK L1DAT2 L1CLK L2DAT1 L2ACK L3DAT1 L3ACK L4DAT1 L4ACK L5DAT0 ID1 RESET IRQ2 TCK REV. C -45- ADSP-21062/ADSP-21062L OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 225-Ball PBGA 0.913 (23.20) 0.906 (23.00) 0.898 (22.80) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 0.791 (20.10) 0.787 (20.00) 0.783 (19.90) TOP VIEW 0.913 (23.20) 0.906 (23.00) 0.898 (22.80) 0.700 (17.78) BSC 0.050 (1.27) BSC 0.791 (20.10) 0.787 (20.00) 0.783 (19.90) DETAIL A 0.101 (2.57) 0.091 (2.32) 0.081 (2.06) 0.026 (0.65) 0.024 (0.61) 0.022 (0.57) 0.050 (1.27) BSC 0.700 (17.78) BSC DETAIL A 0.051 (1.30) 0.047 (1.20) 0.043 (1.10) NOTES SEATING PLANE 1.THE ACTUAL POSITION OF THE BALL ARRAY IS WITHIN 0.12 (0.30) OF ITS IDEAL POSITION RELATIVE TO THE EDGE OF THE PACKAGE. 2.THE ACTUAL POSITION OF ANY BALL IS WITHIN 0.004 (0.10) OF ITS IDEAL POSITION RELATIVE TO THE ARRAY OF BALLS. 0.006 (0.15) MAX 0.035 (0.90) 0.030 (0.75) 0.024 (0.60) BALL DIAMETER -46- REV. C ADSP-21062/ADSP-21062L 240-LEAD METRIC MQFP PIN CONFIGURATIONS 240 1 TOP VIEW 181 180 HEAT SLUG GND 60 61 120 121 THE 240-LEAD PACKAGE CONTAINS A COPPER HEAT SLUG FLUSH WITH ITS TOP SURFACE. THE SLUG IS EITHER CONNECTED TO GROUND OR FLOATING. Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Pin Name TDI TRST VDD TDO TIMEXP EMU ICSA FLAG3 FLAG2 FLAG1 FLAG0 GND ADDR0 ADDR1 VDD ADDR2 ADDR3 ADDR4 GND ADDR5 ADDR6 ADDR7 VDD ADDR8 ADDR9 ADDR10 GND ADDR11 ADDR12 ADDR13 VDD ADDR14 ADDR15 GND ADDR16 ADDR17 ADDR18 VDD VDD ADDR19 Pin No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Pin Name ADDR20 ADDR21 GND ADDR22 ADDR23 ADDR24 VDD GND VDD ADDR25 ADDR26 ADDR27 GND MS3 MS2 MS1 MS0 SW BMS ADDR28 GND VDD VDD ADDR29 ADDR30 ADDR31 GND SBTS DMAR2 DMAR1 HBR DT1 TCLK1 TFS1 DR1 RCLK1 RFS1 GND CPA DT0 Pin No. 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Pin Name TCLK0 TFS0 DR0 RCLK0 RFS0 VDD VDD GND ADRCLK REDY HBG CS RD WR GND VDD GND CLKIN ACK DMAG2 DMAG1 PAGE VDD BR6 BR5 BR4 BR3 BR2 BR1 GND VDD GND DATA47 DATA46 DATA45 VDD DATA44 DATA43 DATA42 GND Pin No. 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 Pin Name DATA41 DATA40 DATA39 VDD DATA38 DATA37 DATA36 GND NC DATA35 DATA34 DATA33 VDD VDD GND DATA32 DATA31 DATA30 GND DATA29 DATA28 DATA27 VDD VDD DATA26 DATA25 DATA24 GND DATA23 DATA22 DATA21 VDD DATA20 DATA19 DATA18 GND DATA17 DATA16 DATA15 VDD Pin No. 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 Pin Name DATA14 DATA13 DATA12 GND DATA11 DATA10 DATA9 VDD DATA8 DATA7 DATA6 GND DATA5 DATA4 DATA3 VDD DATA2 DATA1 DATA0 GND GND L0DAT3 L0DAT2 L0DAT1 L0DAT0 L0CLK L0ACK VDD L1DAT3 L1DAT2 L1DAT1 L1DAT0 L1CLK L1ACK GND GND VDD L2DAT3 L2DAT2 L2DAT1 Pin Pin No. Name 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 220 221 222 223 224 225 226 227 228 229 230 231 232 233 234 235 236 237 238 239 240 L2DAT0 L2CLK L2ACK NC VDD L3DAT3 L3DAT2 L3DAT1 L3DAT0 L3CLK L3ACK GND L4DAT3 L4DAT2 L4DAT1 L4DAT0 L4CLK L4ACK VDD GND VDD L5DAT3 L5DAT2 L5DAT1 L5DAT0 L5CLK L5ACK GND ID2 ID1 ID0 LBOOT RPBA RESET EBOOT IRQ2 IRQ1 IRQ0 TCK TMS REV. C -47- ADSP-21062/ADSP-21062L OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 240-Lead Metric MQFP 1.372 (34.85) 1.362 (34.60) TYP SQ 1.352 (34.35) 1.264 (32.10) 1.260 (32.00) TYP SQ 1.256 (31.90) 1.161 (29.50) BSC SQ 240 1 181 180 0.161 (4.10) MAX 0.030 (0.75) 0.024 (0.60) TYP 0.020 (0.50) SEATING PLANE 240 LEAD METRIC MQFP TOP VIEW (PINS DOWN) LEAD PITCH 0.01969 (0.50) TYP HEAT SLUG LEAD WIDTH 0.011 (0.27) 0.009 (0.22) TYP 0.007 (0.17) GND 0.003 (0.08) MAX 0.010 (0.25) MIN 0.138 (3.50) 0.134 (3.40) TYP 0.130 (3.30) 60 61 INCHES (MILLIMETERS) 121 120 THE THERMALLY ENHANCED MQFP PACKAGE CONTAINS A COPPER HEAT SLUG FLUSH WITH ITS TOP SURFACE; THE SLUG IS EITHER CONNECTED TO GROUND OR FLOATING. THE HEAT SLUG DIAMETER IS 24.1 (0.949) mm. NOTE: THE ACTUAL POSITION OF EACH LEAD IS WITHIN (0.08) 0.0032 FROM ITS IDEAL POSITION WHEN MEASURED IN THE LATERAL DIRECTION. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED. ORDERING GUIDE Part Number ADSP-21062KS-133 ADSP-21062KS-160 ADSP-21062KB-160 ADSP-21062CS-160 ADSP-21062LKS-133 ADSP-21062LKS-160 ADSP-21062LKB-160 ADSP-21062LAB-160 ADSP-21062LCS-160 Case Temperature Range 0C to +85C 0C to +85C 0C to +85C -40C to +100C 0C to +85C 0C to +85C 0C to +85C -40C to +85C -40C to +100C Instruction Rate 33 MHz 40 MHz 40 MHz 40 MHz 33 MHz 40 MHz 40 MHz 40 MHz 40 MHz On-Chip SRAM 2 Mbit 2 Mbit 2 Mbit 2 Mbit 2 Mbit 2 Mbit 2 Mbit 2 Mbit 2 Mbit Operating Voltage 5V 5V 5V 5V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V Package Options MQFP MQFP PBGA MQFP MQFP MQFP PBGA PBGA MQFP -48- REV. C PRINTED IN U.S.A. C3078c-2.5-5/00 (rev. C) 00174 |
Price & Availability of ADSP-21062
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |